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Future-Ready Bonding Technology
ZTACH® ACE Anisotropic Conductive Epoxy – Cures under reflow or UV and can be a replacement for solder, ACF, ACA, and wire bonding. No underfilling required. Find out more.
Action Integrated Resources
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Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.
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BPA, due to its 30 year history in research and analysis in the electronics / optoelectronics industry, continues to provide clients with a clearer picture on which technologies will be demanded in the future.
BPA works with many clients throughout the industry supply chain, bringing unique insights into key factors that can critically affect the uptake of new technologies and the development of emerging markets.
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BPA Consulting Ltd.
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