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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Offers handling and staging equipment for manufacturing in the medical product assembly, automotive sub assembly, box build, and PC board assembly industries.
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Bliss Industries Inc.
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