circuit insight
Sponsor
Circuit-Technology-Center

100+ Expert Repair & Rework Guides - All in One Place
Take the guesswork out of circuit board repair. This guidebook delivers proven methods to help you repair and rework assemblies to IPC standards.
Circuit Technology Center
Sponsor
Master-Bond

Silver Filled Electrically Conductive Epoxy
Master Bond EP3HTSDA-2Med is a silver filled adhesive system with high electrical and thermal conductivity that passes ISO 10993-5 for cytotoxicity.
Master Bond
Beans International Corporation's (BIC) mission is to supply the best process equipment available in Japan and other Asian countries to the American device/PCB manufacturers.

Although the company itself is still relatively new, our staff has 15+ years of experience in marketing quality test equipment in the United States. We have carefully chosen the most reliable and cost-effective products which can significantly improve production throughput, yield, and product quality, while substantially reducing manufacturing costs.

BEANS International Corp.

Press Releases
Contact Information
WEBSITE
UPDATE THIS LISTING