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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Assembleon is a global supplier of Surface Mount Technology Pick & Place solutions for the electronics manufacturing industry. Assembleon is a trustworthy partner, providing full application support, training and services. We offer a product that can be easily integrated into your manufacturing environment, ensuring your equipment runs competitively at all times.
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Assembleon America, Inc.
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