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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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MacDermid Alpha Electronics Solutions, a business unit of Element Solutions Inc, is a global leader in high-performance specialty chemicals, materials, and process technologies that enable advanced interconnects from wafer to board.
Through advanced, sustainable, and integrated solutions for wafer-level packaging, semiconductor assembly, and circuit board assembly, we help manufacturers enhance reliability, productivity, and performance across the electronics supply chain.
Backed by more than a century of innovation and a global network of R&D and applications experts, MacDermid Alpha partners with customers in automotive, consumer electronics, data infrastructure, and high-performance computing to power next-generation electronics.
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MacDermid Alpha Electronics Solutions
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