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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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The Industry Standard Solder Paste
Looking to Avoid the Void® and enhance SIR performance? Indium8.9HF is your proven, versatile and stable, no-clean, halogen-free, Pb-free solder paste solution.
Indium Corporation
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MacDermid Alpha Electronics Solutions, a business unit of Element Solutions Inc, is a global leader in high-performance specialty chemicals, materials, and process technologies that enable advanced interconnects from wafer to board.
Through advanced, sustainable, and integrated solutions for wafer-level packaging, semiconductor assembly, and circuit board assembly, we help manufacturers enhance reliability, productivity, and performance across the electronics supply chain.
Backed by more than a century of innovation and a global network of R&D and applications experts, MacDermid Alpha partners with customers in automotive, consumer electronics, data infrastructure, and high-performance computing to power next-generation electronics.
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MacDermid Alpha Electronics Solutions
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