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Research & Technical Papers
Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
Many center pad voiding studies have focused on center pad ...
Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
The understanding of the growth mechanism for tin whiskers and ...
Mitigating Tin Whiskers in Alternative Lead-Free Alloys
As lead-free alloys shift into high reliability electronics, the issue ...
Conformal Coating over No Clean Flux
The need to implement a tin whisker mitigation strategy has ...
VOC Free Flux Study
The purpose of this study is to explain several factors ...
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AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry. Our product line includes solder paste, liquid flux, bar solder, cored and solid wire solder, preforms, adhesives, cleaners, chemicals, plating anodes, indium and gold alloys and more. AIM's product line also includes an extensive variety of lead-free solder alloys.

AIM offers manufacturing, distribution and support facilities located throughout the world. Recipient of many SMT industry awards, AIM is strongly committed to innovative research and the continual development of product and process improvement and providing customers with superior technical support, service and training worldwide.
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Phone: 401-463-5605, 401-463-0203
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