| Sponsor |
|
AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
|
|
| Sponsor |
|
SAWA SC-BM500E Automatic Stencil Cleaner
Ultrasonic combined with spray cleaning provides an excellent solution for all kinds of applications including wafer bump and electroform stencils.
Seika
|
|
|
AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry. Our product line includes solder paste, liquid flux, bar solder, cored and solid wire solder, preforms, adhesives, cleaners, chemicals, plating anodes, indium and gold alloys and more. AIM's product line also includes an extensive variety of lead-free solder alloys.
AIM offers manufacturing, distribution and support facilities located throughout the world. Recipient of many SMT industry awards, AIM is strongly committed to innovative research and the continual development of product and process improvement and providing customers with superior technical support, service and training worldwide.
|
|
AIM Solder
|
|