Research
In-Line Testing of Highly Panelized PCBAs with Parallel Functional Test
Electrochemical Reliability as a Function of Component Standoff
Reliable Nickel-Free Surface Finish for High-Frequency-HDI PCB
Enclosed Media Printing as an Alternative to Metal Blades
Risk for Ceramic Component Cracking Dependent
Nanocopper Based Paste for Solid Copper Via Fill
Fluxless Die Attach by Activated Forming Gas
Embracing a New Paradigm: Electronic Work Instructions (EWI)
MORE RESEARCH
Latest Industry News
Global Chip Shortage Is Impacting Carmakers
VIEWPOINT 2021: Raymond M. LaFleur, General Manager of Overseas Sales and Marketing, DEN-ON
VIEWPOINT 2021: Mark Cottom, Vice President of Sales & Marketing, National Circuit Assembly
Geely and Foxconn form partnership to build cars for other automakers
Samsung Debuts World's First Wi-Fi 6E Mobile Phone
IBM tops US patent list for 28th year in a row with more than 9,100 patents granted
5G Makes Waves At CES 2021
4 Reasons a Retreat Into Nature Will Increase Productivity
MORE INDUSTRY NEWS

6G Mobile Communications to Utilize AI to Control Devices



6G Mobile Communications to Utilize AI to Control Devices
The 6th generation of mobile communications promises higher data rates, shorter latency, and increased densities of terminal devices..
Technology Briefing

Transcript


5G will be followed by 6G: The 6th generation of mobile communications promises even higher data rates, shorter latency, and strongly increased densities of terminal devices while exploiting Artificial Intelligence (or AI) to control devices or autonomous vehicles in the Internet-of-Things era. To simultaneously serve as many users as possible and to transmit data at the utmost speed, future wireless networks will consist of a large number of small radio cells. In these radio cells, distances are short so that high data rates can be transmitted with minimum energy consumption and low electromagnetic emission. The associated base stations will be compact and can easily be mounted to building facades or streetlights.

To form a powerful and flexible network, these base stations need to be connected by high-speed wireless links that offer data rates of tens or even hundreds of gigabits per second. This may be accomplished by terahertz carrier waves, which occupy the frequency range between microwaves and infrared light waves. However, terahertz receivers are still rather complex and expensive and often represent the bandwidth bottleneck of the entire link.

Researchers at Karlsruhe Institute of Technology (or KIT) have now developed a novel concept for low-cost terahertz receivers that consist of a single diode in combination with a dedicated signal processing technique. In a proof-of-concept experiment, reported in Nature Photonics, the team demonstrated transmission at a data rate of 115 Gbit/s and a carrier frequency of 0.3 THz over a distance of 110 meters.

At its core, the receiver consists of a single diode, which rectifies the terahertz signal. The diode is a so-called Schottky barrier diode, which offers large bandwidth and that is used as an envelope detector to recover the amplitude of the terahertz signal. Correct decoding of the data, however, additionally requires the time-dependent phase of the terahertz wave that is usually lost during rectification. To overcome this problem, the researchers used digital signal processing techniques in combination with a special class of data signals, for which the phase can be reconstructed from the amplitude Using their receiver concept, the scientists achieved a transmission rate of 115 Gbit/s at a carrier frequency of 0.3 THz over a distance of 110 m. This is the highest data rate so far demonstrated for wireless terahertz transmission over more than 100 meters. The terahertz receiver developed by KIT stands out due to its technical simplicity and lends itself to cost-efficient mass production.

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Board Talk
Is There a Spacing Spec for SMD Components?
Maximum Board Temperature During Tin-Lead
Is HASL a Good Choice for Surface Finish?
Connector Bowing During Reflow Process
Has My Flux Expired?
Long Term Component Storage
Processing Circuit Boards with BGAs On Both Sides
What Causes Solder Balls During Hand Soldering?
MORE BOARD TALK
Ask the Experts
Mixing Different SAC305 Solders
Dross Particles Sticking to PCBs
Cleaning with Sodium Bicarbonate
Conformal Coating Over Heat Sinks
Flux Oozing from Insulated Wires
Conformal Coating in Low Humidity Environments
Tiny Solder Balls After Reflow
Solder Paste Alloy Check
MORE ASK THE EXPERTS