Research
Stencil Printing Yield Improvements
Overcome Nodules and Scratches on Wire Bondable Plating on PCBs
Solder Paste Selection for Bottom Termination Components Attach
Jetting Solder Paste Opens Up New Possibilities
Advances Autonomous Driving V2X Technologies
Surface Insulation Resistance of No-Clean Flux Residues
Jetting Conductive Adhesives with Silver Coated Polymer Particles
Residues on Probing PCBAS-Consistent Connections Across No-Clean Fluxes
MORE RESEARCH
Latest Industry News
Applying Strategic Sourcing Principles to Modern Procurement
Should You Trust Apple's New Blood Oxygen Sensor?
Cobalt demand for 5G technology to challenge electric vehicles
S. Korea to launch supercomputer for biotechnology in 2023
China needs first mover advantage in digital currency race
Top 10 Digital Transformation Trends For 2021
Chinese leaders split over releasing blacklist of U.S. companies
It's getting harder for tech companies to bridge the US-China divide
MORE INDUSTRY NEWS

High-Speed 3D Surface Imaging Technology in Electronics Manufacturing



High-Speed 3D Surface Imaging Technology in Electronics Manufacturing
This paper introduces line confocal technology that was developed to characterize 3D features of surface and material types at sub-micron resolution.
Analysis Lab

DOWNLOAD

Authored By:


Juha Saily, FocalSpec, Inc., Santa Clara, CA, USA

Summary


This paper introduces line confocal technology that was recently developed to characterize 3D features of various surface and material types at sub-micron resolution. It enables automatic microtopographic 3D imaging of challenging objects that are difficult or impossible to scan with traditional methods, such as machine vision or laser triangulation. Examples of well-suited applications for line confocal technology include glossy, mirror-like, transparent and multi-layered surfaces made of metals (connector pins, conductor traces, solder bumps etc.), polymers (adhesives, enclosures, coatings, etc.), ceramics (components, substrates, etc.) and glass (display panels, etc.). Line confocal sensors operate at high speed and can be used to scan fast-moving surfaces in real-time as well as stationary product samples in the laboratory. The operational principle of the line confocal method and its strengths and limitations are discussed. Three metrology applications for the technology in electronics product manufacturing are examined: 1. 3D imaging of etched PCBs for micro-etched copper surface roughness and cross-sectional profile and width of etched traces/pads. 2. Thickness, width and surface roughness measurement of conductive ink features and substrates in printed electronics applications. 3. 3D imaging of adhesive dots and lines for shape, dimensions and volume in PCB and product assembly applications.

Initially Published in the SMTA Proceedings

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Board Talk
Solder Pallets With Titanium Inserts - Yes/No?
What Rate is World Class for SMT Machines?
Selective Solder Pot Temperatures
Top Side Reflow Causing Solder Balls
Trends for Printing Ultra Miniature Chips
Should We Measure Solder Paste Thickness?
Cleaning R.F. Circuits - Aqueous or Vapor?
Why Should We Consider Smart Feeders?
MORE BOARD TALK
Ask the Experts
SMT Target Component Placement
Problems With Large Voids
Stainless Steel Benches and ESD
Exposed Copper Defect
What's Causing Cloudy Conformal Coating
Channels To Reduce Voids in Large Pads
Options for Reballing BGA Components
Aluminum Trays and Rapid Static Discharge
MORE ASK THE EXPERTS