Research
Leadless Flip Chip PLGA for Networking Applications
Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
Designing a High Performance Electroless Nickel and Immersion Gold
Innovative of CU Electroplating Process for Any Layer Via Fillwith Planer Via Top and Thin Surface Copper
Acoustic Micro Imaging Analysis for 3D Packages
Conformal Coatings in Preventing Resistor Silver Sulfide Corrosion
Rework Challenges for Leading Edge Components BGA, QFN and LED
Compatibility and Aging for Flux and Cleaner Combinations
MORE RESEARCH
Latest Industry News
Globalization strikes back
Self-driving technology reaches a crossroads
The Art of Wanting Less
Amazon is everywhere. Here's how the US could break it up
The Best Laptops 2021
Foxconn installs advanced packaging equipment at China plant
Foxconn installs advanced packaging equipment at China plant
Here’s the latest proof that Apple is fixing the iPhone notch
MORE INDUSTRY NEWS

Vapor Phase - Improvement Under Oxidation Free Soldering Conditions



Vapor Phase - Improvement Under Oxidation Free Soldering Conditions
Modern vapor phase soldering systems based on new technologies have eliminated the disadvantages inherent to condensation systems.
Production Floor

DOWNLOAD

Authored By:


Claus Zabel
ASSCON Systemtechnik GmbH
86343 Konigsbrunn, Germany

Summary


Due to the switch to lead-free, high packing density, extreme mix of light/heavy components manufacturers are faced with multiple new challenges. Simple processing, successful soldering for various products, high quality and user-riendliness are the basic requirements that current soldering systems have to provide. Vapor phase soldering meets these demands. However, individual systems vary greatly when looking at important details.

Conclusions


Modern vapor phase soldering systems based on newest technologies have eliminated the disadvantages inherent to early condensation systems.

Vapor phase soldering offers best reflow thermal treatment technology for all kind of high tech soldering application. By employing saturated vapor not only for the heating but also the pre-heating phase, any risk of oxidization is eliminated. In addition, precise medium temperature settings eliminate overheating of the product in any stage of the soldering process.

Variable temperature gradient control provides optimum pre-heat and soldering for any product. If also a VACUUM or even MULTIVACUUM Process is intergrated into the Vapor phase soldering process best possible and void free quality of soldering is ensured.

Initially Published in the SMTA Proceedings

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Board Talk
What Causes Solder Icicles During Wave Soldering
Modify Rework Procedures for Assemblies Fabricated Using OSP?
Can High Particle Concentrations Impact PCB Assembly?
Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
Moisture Barrier Bag Issues
Trouble With Skewed DPAK Components
Can Mixing Wave Solder Pallets Cause Contamination?
How to Reduce Voiding on QFN Components
MORE BOARD TALK
Ask the Experts
Suggested Limit for PCBA Heat Cycles
Average Temperature/Humidity for an Electronics Assembly Facility?
ENIG Solderability Issues
Very Low Temp PCBs
0201 Pick & Place Nozzle Plugging
IPC-A-610 Class 3 - IPC-A-600 Class 2
BGA Solder Ball Collapse
Baking After Cleaning Hand Placed Parts
MORE ASK THE EXPERTS