Research
Evaluating Manual and Automated Heat Sink Assembly
Bending Strength of Solder Joints as a Function of Joint Length
Effect of Bi Content on Properties of Low Silver SAC Solders
Rigid-Flex PCB Right the First Time - Without Paper Dolls
Effect of Thermal Cycling on Subsequent Drop Behavior of Assemblies
High and Matched Refractive Index Liquid Adhesives for Optical Device
Stencil Design for Ultra Fine Pitch Printing
Electroplated Copper Filling of Through Hole Influence of Hole Geometry
MORE RESEARCH
Latest Industry News
Hon Hai's US Plant Wins Google Server Contract
Can Detroit Catch Tesla?
Xiaomi's revenue growth spikes after Huawei slide
Samsung takes one-third of global TV market in Q3
Conversational Commerce Is Revolutionizing Ecommerce
MIT Project Helps ALS Patients Communicate Using Sensors
Turning the Body Into a Wire
iPhone 12 Pro Max Teardown
MORE INDUSTRY NEWS

Reliability Improvements by the Creation of Intermetallic Connections



Reliability Improvements by the Creation of Intermetallic Connections
The possibilities to combine small and large passive components, and new devices for active components with an increase in reliability is discussed.
Materials Tech

DOWNLOAD

Authored By:


Jorg Trodler, Dipl.-Ing.
Heraeus Deutschland GmbH&Co.KG
Hanau, Germany

Dr. Ing. Habil Heinz Wohlrabe
Technical University Dresden
Dresden, Germany

Summary


Especially for the SMT new trends like miniaturization 0201, 01005, 0201 (metrics) for passive components, as well as new devices for actives like LGA or QFN, it requires a lot of investigation for researching, developing, questioning about application, product/component mix, and finally about reliability. One major challenge is the combination of small, medium and large components in one production step. For example, large components need more solder paste, based on a thicker stencil than small components.

Several studies have shown, that properties for reliability at a temperature cycle e.g. -40/+125 prolonged its lifetime by increasing an intermetallic phase (IMP) between substrates and component finishes (e.g. Papers Trodler SMTAi 2012-14). This paper will show and discuss the possibilities by application to combine small and large passive components, and new devices for active components with an increase in reliability, especially for automotive/industry requirements by an IMP formation.

Conclusions


Based on the positive results for reliability and the challenge for more complex boards without using different types of paste (powder size) and stencils, more assembly steps, a project has been started for harmonizing and searching the limits with solder paste and one stencil thickness as well as different openings in the stencil. With those results, the process flow can be described and additional reliability test could be follow to proof an increasing for bigger component as well.

Initially Published in the SMTA Proceedings

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Board Talk
Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
Can High Particle Concentrations Impact PCB Assembly?
Trouble With Skewed DPAK Components
Moisture Barrier Bag Issues
How to Reduce Voiding on QFN Components
Can Mixing Wave Solder Pallets Cause Contamination?
Do BGA Components Warp During Reflow?
Calculating Failure Rate During Rework
MORE BOARD TALK
Ask the Experts
Insufficient Plated Hole Fill with Electrolytic Capacitors
Through Hole Connector Solder Joint Hole Fill
Selective Solder System Purchased At Auction
Out-gassing and Cleaning
Stencil Cleaning Procedure
Challenging Cleaning Problem
Selective Printing for BGA Components
BGA Joint Voids - Accept or Reject?
MORE ASK THE EXPERTS