Research
Leadless Flip Chip PLGA for Networking Applications
Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
Designing a High Performance Electroless Nickel and Immersion Gold
Innovative of CU Electroplating Process for Any Layer Via Fillwith Planer Via Top and Thin Surface Copper
Acoustic Micro Imaging Analysis for 3D Packages
Conformal Coatings in Preventing Resistor Silver Sulfide Corrosion
Rework Challenges for Leading Edge Components BGA, QFN and LED
Compatibility and Aging for Flux and Cleaner Combinations
MORE RESEARCH
Latest Industry News
Globalization strikes back
Self-driving technology reaches a crossroads
The Art of Wanting Less
Amazon is everywhere. Here's how the US could break it up
The Best Laptops 2021
Foxconn installs advanced packaging equipment at China plant
Foxconn installs advanced packaging equipment at China plant
Here’s the latest proof that Apple is fixing the iPhone notch
MORE INDUSTRY NEWS

Embedded Fibers Enhance Nano-Scale Interconnections



Embedded Fibers Enhance Nano-Scale Interconnections
This paper introduces the use of embedded fibers in the interconnections of chip-to-chip and chip-to-package components.
Materials Tech

DOWNLOAD

Authored By:


V. Desmaris, S. Shafiee, A. Saleem, A. Johansson, P. Marcoux
Smoltek AB, Gothenberg Sweden

Summary


While the density of chip-to-chip and chip-to-package component interconnections increases and their size decreases the ease of manufacture and the interconnection reliability are being reduced. This paper will introduce the use of embedded fibers in the interconnections as a means of addressing these issues.

Flip chips bumps are evolving from large solder balls down to small thin copper pillars. Some copper pillars are solder capped and use a thermo-compression reflow attachment process. Smaller diameter copper pillars, while desirable by users, present a significant challenge to assemblers and reliability issues for end-users.
Nanostructures in the form of carbon nano-tubes have been evaluated for years.

The recently created a means of growing metallic carbon nano-fibers, CNF's, to micro bumps which are solderable. When embedded with solder the fiber bumps produce robust component interconnections which can be less than 10 um in diameter and up to 20 um high. Attachment of the fiber micro bumps uses conventional thermo-compression bonding.
Results from the most recent evaluations will be presented indicating electrical performance and showing ease of manufacture resulting of such solder coated carbon nano-fiber micro bumps.

Conclusions


As solder joints get smaller their reliability and fatigue life drops. Adding carbon nano fibers and combining with the solder significantly enhances the fatigue life of the solder joints.

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Board Talk
What Causes Solder Icicles During Wave Soldering
Modify Rework Procedures for Assemblies Fabricated Using OSP?
Can High Particle Concentrations Impact PCB Assembly?
Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
Moisture Barrier Bag Issues
Trouble With Skewed DPAK Components
Can Mixing Wave Solder Pallets Cause Contamination?
How to Reduce Voiding on QFN Components
MORE BOARD TALK
Ask the Experts
Suggested Limit for PCBA Heat Cycles
Average Temperature/Humidity for an Electronics Assembly Facility?
ENIG Solderability Issues
Very Low Temp PCBs
0201 Pick & Place Nozzle Plugging
IPC-A-610 Class 3 - IPC-A-600 Class 2
BGA Solder Ball Collapse
Baking After Cleaning Hand Placed Parts
MORE ASK THE EXPERTS