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Research & Technical Papers
Technical papers are pulled from the database at Circuitnet. SUBMIT
Research links are papers authored by your company that are hosted at Circuit Insight.
Assembly Process Feasibility of Low Silver Solder Paste
This paper presents performance/process capability of various low/no silver alloy ...
Numerical Study on New Pin Pull Test for Pad Cratering
In this study a new pin pull test method with ...
AXI Applications with BTC and Connectors
What is the best way to use test and inspection ...
Press Fit Roadmap for High Performance Process
Paper investigates the roadmap for press fit technology, with attention ...
3D Assembly Processes a Look at Today and Tomorrow
This paper explores various technologies available today and some that ...
Selective Reflow Rework Process
This paper discusses some aspects of the process optimization and ...
Reliability Study of Low Silver Alloy Solder Pastes
Paper presents the reliability study of lead-free solder joints reflowed ...
Study on Solder Joint Reliability of Fine Pitch CSP
In the future more fine pitch CSP components will be ...
Head in Pillow X-ray Inspection at Flextronics
For the study we used two boards exhibiting HIP defects ...
Soldering Improvement for SMT Connectors
This paper covers experiments for improving the SMT process for ...
Comparison of SAC105 and SAC305 Solders
In this paper, the thermal fatigue performance under accelerated test ...
Assembly Options for Handheld Products
Paper covers assembly and material alternatives to make a handheld ...
Nano Tech Improves Critical Printing Process
Paper covers how nano coating over stencil openings will improve ...
Pad Cratering Evaluation of PCBs
This paper reviews major publications and research reports with regard ...
Creep Corrosion of PWB Final Finishes
This paper demonstrates that creep corrosion on a PWB is ...
Assembly Challenges of Bottom Terminated Components
This paper discusses the design, assembly and inspection challenges of ...
X-rays vs. Cross Sections to Measure Voids
This paper validates void measurements obtained from non-destructive imaging techniques, ...
Reliability of Multiple Pb-free Solder Ball Alloys
Paper covers a screening experiment to obtain data comparing thermal ...
Design of New Solder Attach Technologies
Paper outlines a new technology with a focus on design ...
Evaluation of Lead-free Solder Pastes
This paper discusses the strategy and methodology for selecting a ...
Test Optimization to Improve Rework
Paper reviews how to use test machines to diagnose defects ...
More Information
Headquartered in Singapore, Flextronics is a leading Electronics Manufacturing Services (EMS) provider focused on delivering complete design, engineering and manufacturing services to automotive, computing, consumer digital, industrial, infrastructure, medical and mobile OEMs.

With the acquisition of Solectron, pro forma fiscal year 2008 revenues from continuing operations are more than US$33.6 billion.
Presentations

Flextronics International

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