Research



Circuit Insight contains thousands of technical papers, video presentations, expert analysis and more focused on the world of electronics manufacturing. Use the search above or visit the various links below.

A


Adhesives


B


Baking
BGA Reballing
BGA Rework


C


CAD
Cleaning
Coatings
Component Insertion
Conformal Coating
Contamination
Copper Dissolution
Corrosion
Counterfeit Components
Creep Corrosion
Cross Section
Curing


D


Data Acquisition
Design
Dispensing
Drop Test
Dust


E


Embedded Technology
ESD
EOS


F


Fatigue
Feeders
Finishes
Flex Circuits
Flip Chip
Flux


G


Gull Wing


H


Hand Sanitizers
Handling
Head-In-Pillow
High Frequency


I


Inspection
Intrusive Soldering


J


Jetting


L


Labeling
Lasers
Lead Free


M


Marking
Measurement
Mechanical Shock
Microvias
Modeling
Modification


O


Optical Inspection
Outsourcing


P


Packaging
Package On Package
Pad Cratering
Pick and Place
Printing
Profiling


Q


QFN Assembly


R


Reliability
Reflow
Reflow Profiling
Repair
Rework
Robotic Soldering
RoHS
RFID


S


Solders
Soldering
Solder Defects
Solder Mask
Solder Paste
Sn/Cu/Ni
Stencils


T


Thermal Cycle
Thermal Zones
Tombstoning


V


VOC
Voids


W


Whiskers


X


X-ray

Programs



Board Talk


Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
Phil Zarrow
Phil Zarrow - With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
Jim Hall
Jim Hall - A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.

Defect of the Month


Bob Willis
Defect of the month is presented by Bob Willis. For decades Bob has been providing solutions for process and product failure trouble shooting, in-house training, process engineering support and product failure analysis.

Mysteries of Science


Dr. Gilleo
Mysteries of Science are written by Dr. Ken Gilleo. Dr. Gilleo is a chemist, inventor and general problem solver. Ken has been tracking industrial forensics and collecting case histories for decades.

Technology Briefing


Technology Briefing
Brought to you by association with Audio-Tech, publishers of Tends Magazine where you'll learn about big ideas, new products, breakthrough concepts, and trailblazing technologies.

Channels



Adhesives, Coating, Dispensing


These programs cover adhesives, epoxies, bonding, coatings, tapes, jetting, dispensing and more.

Assembly, Printing, Pick & Place


These programs cover manual and automated assembly, screen and stencil printing, pick & place systems and more.

Baking, Ovens, Moisture Control


These programs cover batch and inline baking, curing, ovens, moisture control, vacuum sealing and more.

Cleaning, Washing, Solvents


These programs cover manual and automated cleaning systems, water and other solvent based cleaning and cleaning solutions.

Contamination, Defects, Whiskers


These programs cover problems and solutions associated with contamination, defects, tin whiskers and more.

Environment, RoHS, Recycling


These programs cover the environment, RoHS, recycling, pollution, storage, ESD, waste and more.

Flip-Chip, MEMS, Semiconductors


These programs cover flip-chip, chip scale packaging, MEMS, semiconductors and more.

Operations, Productivity, Supply


These programs cover overall operations, plan productivity, issues with the supply chain and more.

PC Fab, Board Design, Laminates


These programs cover bare PC board fabrication, circuit board design, laminates and more.

Reflow Soldering, Profiling


These programs cover reflow soldering, vapor phase, profiling, thermocouples, data collection and more.

Rework, Repair, Modification


These programs cover BGA rework, BGA reballing, tinning, damage repair, jumper wires, modifications and more.

Soldering, Selective, Wave


These programs cover manual and automated soldering, selective soldering, wave soldering and more.

Solders, Fluxes, Pastes


These programs cover solders, alloys, fluxes, flux residues, solder pastes, lead-free, SIR and more.

Test, Inspection, X-Ray


These programs cover manual and automated test, manual and automated optical inspection, x-ray and more.