Electronics Assembly Knowledge, Vision & Wisdom
SIR Test Method for Developing Evidence for the Production Assembly
SIR Test Method for Developing Evidence for the Production Assembly
The purpose of this paper is research on the development of temperature-humidity-bias instrumentation and test board designs forproduct acceptance.
Analysis Lab

Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name

Your Company

Your E-mail

Your Country

Your Comment

Authored By:
Mark McMeen
STI Electronics, Madison, AL

Doug Pauls
Collins Aerospace, Cedar Rapids, IA

Mike Bixenman
KYZEN Corporation, Nashville, TN

Since the 1970s, ROSE testing was used to determine "clean enough." In 2015, the J-STD-001 committee assigned a team to develop the next generation of "cleanliness" requirements. Section 8 defines the key concepts that drove the need for developing new cleanliness requirements.

A qualified manufacturing process requires assemblers to qualify solderingand cleaning processes that result in acceptable levels of flux and other residues. This paper reported research on both test boards and instrumentation for use at the assembly site. The instrument and test board combinations are tools that process engineers and line personnel can use to develop objective evidence as it relates to the cleanliness of production hardware.

Initially Published in the SMTA Proceedings

No comments have been submitted to date.
Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search

Program Search
Related Programs
bullet Pad Crater Initiation in Shock Using Acoustic Emission Detection
bullet Industry 4.0 for Inspection in the Electronics Industry
bullet Board Level Reliability Comparison of BGA and LGA Packages
bullet Second Roung Robin Evaluation of iNEMI Creep Corrosion Qualification Test
bullet Novel Pogo-Pin Socket Design for Automated Linearity Testing
bullet Solder Paste Inspection - When and Why
bullet Will Typical No Clean Paste Pass an SIR Test?
bullet Mechanical Shock and Drop Reliability Evaluation of the BGA Solder Joint Stack-Ups
bullet AOI Capabilities Study with 03015 Components
bullet Design for Testability to Overcome Functional Board Test Complexities
More Related Programs