Electronics Assembly Knowledge, Vision & Wisdom
Top 5 BGA Rework Challenges to Overcome
Top 5 BGA Rework Challenges to Overcome
As BGA component package dimensions continue to get thinner more are being used in handheld device applications. The challenges of BGA rework is discussed.
Analysis Lab

Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name

Your Company

Your E-mail

Your Country

Your Comment

Authored By:
Bob Wettermann, MIT
Rolling Meadows, IL, USA

As BGA component package dimensions continue to get thinner as more of them are being used in handheld device applications. End use device requirements include the need to maintain their interconnections, even when dropped, thus necessitating the use of underfill. The increased demand for higher board densities requires neighboring or mirrored devices during the rework process to be more challenging. Higher reflow temperatures of 'lead free' rework increases the pressure for properly shielding the neighboring components. These developments are causing BGA rework challenges. This summary will discuss the most challenging aspects of BGA rework and options for solutions.

The above discussion is a snapshot in time with respect to the top BGA rework challenges. These challenges, in no particular order, were that of: Excessive BGA warping due to thinning packages, shielding of neighboring devices in an era of increasing component density, underfilled BGA device removal and replacement, as well as the repair of solder mask. In addition to these current challenges others including reworking ever-finer devices pitches and integrating lower reflow temperature solders are rework trials that will be added to this list soon.

Initially Published in the SMTA Proceedings

No comments have been submitted to date.
Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search

Program Search
Related Programs
bullet Reservior Printing in Deep Cavities
bullet Selective Solder Paste Printing for BGA Components
bullet Advanced Second Level Assembly Analysis Techniques
bullet Print Performance Studies Comparing Electroform and Laser-Cut Stencils
bullet Predicting the Reliability of Package-On-Package Interconnections
bullet Issues With SMT Component Alignment
bullet Material Selection and Optimization for TMV PoP
bullet Larger Stencil Apertures and Type 4 Paste
bullet Assembling Boards with BGAs on Both Sides
bullet Electronic Packages and Modules Based on Embedded Die Technologies
More Related Programs