Research
Fill the Void II: An Investigation into Methods of Reducing Voiding
Final Finish Specifications Review
DFX on High Density Assemblies
Challenges on ENEPIG Finished PCBs
Testing PCBs for Creep Corrosion
Screening of Lower Melting Point Pb-Free Alloys
Hand Printing using Nanocoated and other High End Stencil Materials
Board Processes and Effects on Fine Copper Barrel Cracks
MORE RESEARCH
Latest Industry News
Foxconn Says China Can No Longer Be 'The World's Factory'
Microsoft's new phone is ... $1,400? Why?
Hon Hai says Q2 results satisfactory
China Launches Beidou, Its Own Version of GPS
Do Engineers Live Longer? A Look at Occupational Factors' Effect on Longevity
The iPhone is still breaking sales records during the pandemic
How to Work from Home Successfully
Smartphone shipments in China plunge 35% in July
MORE INDUSTRY NEWS

Electronic Packages and Modules Based on Embedded Die Technologies



Electronic Packages and Modules Based on Embedded Die Technologies
This paper describes the use of embedded die technologies and the development of work in the on power electronic applications.
Production Floor

DOWNLOAD

Authored By:


Lars Boettcher, Stefan Karaszkiewicz, Andreas Ostmann
Fraunhofer Institute for Reliability and Microintegration (IZM)

Dionysios Manessis
Technical University of Berlin
Berlin, Germany

Summary


This paper will describe the use of embedded die technologies for various application fields. The main focus of the development work in the presented European funded project EmPower [1] is on power electronic applications. Here, three different power levels are of interest:
1. 50W single die packages with fast rectifier diodes
2. 500W power modules for electric bicycle application
3. 50kW power modules for HEV and EV application

All three application fields are based on a similar concept, which is called embedded power core. For the higher power modules additionally thermal management is required. Here a construction of IMS substrates and the power core is chosen. This construction enables a double sided cooling and also the electrical isolation of the module to the cooler. The connection between power core and IMS substrates is made by low temperature and low pressure Ag sintering.

All three applications fields will be described in detail. Besides the power core manufacturing, the paper will elaborate on the sintering process for Power Core/IMS interconnections, the microscopically features of the sintered interfaces, and the lateral filling of the sintering gap with epoxy prepregs.

For 500W power modules, which were manufactured using this approach, solder reflow testing and active power cycling results will be discussed in detail.

Additionally the development work toward the realization of the 50kW module will be described.

Conclusions


The presented work within the EmPower project, demonstrates continues development of a new concept in the embedded die technology for power electronic packages and modules. The development work of all three different addressed power classes is described in detail.

For the 50W Schottky diode package a new process flow was developed and successfully applied to create fully symmetric, single die packages. First reliability testing proves the robustness of the developed technology.

For the 500W and 50kW modules the focus of work lies on the sinter lamination technology, which is applied for module finalization, enabling improved thermal management, by providing the option of double sided cooling, and realizing the high current connections to the module.

For all three application areas functional test vehicles were realized or are currently underway. A full reliability assessment will be applied to all of the demonstrators, to demonstrate the robustness of the developed technologies.

Initially Published in the SMTA Proceedings

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Board Talk
Cleaning Reballed BGA Components
We Bake, But Still Have Delamination, Why?
Reflow For Rigid Flex
Solder Paste Volume for BGA Rework
Problems With Starved "J" Lead Joints
Delay Before Cleaning Partial Assemblies
Can a CTE Mismatch Cause Reliability Problems?
Solder Paste Transfer Efficiency - What/Why
MORE BOARD TALK
Ask the Experts
Soldering Components with Silver Pads
Environment Impact on Assembly, Printing and Reflow
Solder Balling Prediction Formula
Old Components and Blow Holes
Estimating Failure Rate During Rework
Coating to stop tin whisker growth?
Cleaning an assembled board with IPA
Remove and replace a 240 pin connector
MORE ASK THE EXPERTS