Electronics Assembly Knowledge, Vision & Wisdom
DFX on High Density Assemblies
DFX on High Density Assemblies
This paper discusses selection of the correct solder paste based on end product and the need to conduct proper root cause analyses before making any material changes.
Materials Tech

Authored By:
Jonas Sjoberg
Indium Corporation
Kuala Lumpur, Malaysia

Chris Nash, David Sbiroli
Indium Corporation
Utica, NY, USA

Wisdom Qu
Indium Corporation
Suzhou, China
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Implementing high-density assembly in all electronic products requires many considerations. Before starting any development work or implementing a new technology, it is critical to understand the product and industry requirements and capabilities. If this is not fully understood, failure is the most probable outcome.

This paper will discuss selection of the correct solder paste based on the end product and the need to conduct proper root cause analyses before making any material or process changes.
It is very important to understand design, materials, and process since they are very closely connected. There are many ways to achieve high-density assemblies, and it is crucial to have a "toolbox of technologies" to be able to fulfill various requirements. It is also necessary to consider the interaction between multiple technologies in all areas during development and deployment since several advanced technologies will, in most cases, be used on the same product. Depending on the end product, several options can be considered and the selection should be based on data and not assumptions.
Initially Published in the SMTA Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name






Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.

Related Programs
bullet Lower Temperature Solder Joint Encapsulant
bullet Conformal Coating Recommendation
bullet Thermally, Electrically Conductive Adhesive to Control Heat in PCBs
bullet SMT Adhesive Inspection
bullet How to Protect Internal Circuitry from a Harsh Environment
bullet Signal Loss in a High Speed High Frequency Transmission Line
bullet Quantitative Analysis of Corrosion Resistance
bullet DFX on High Density Assemblies
bullet Tin Whisker Risk Management by Conformal Coating
bullet A Novel Conformal Back-Up Material
More Related Programs