Electronics Assembly Knowledge, Vision & Wisdom
Challenges for Selecting Appropriate TIM2 Material for CPU
Challenges for Selecting Appropriate TIM2 Material for CPU
This paper provides a methodology for a potential TIM2 material for applications including automotive, personal computers and internet of things.
Materials Tech

Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name

Your Company

Your E-mail

Your Country

Your Comment

Authored By:
Priyanka Dobriyal, Sumit Soni, Chet Lee
Intel Corporation
Hillsboro, OR, USA

Ever-increasing amounts of heat in a small and very concentrated area, which can be detrimental to CPU performance. To dissipate generated heat to the external environment, a heatsink with a thermal interface material (TIM2) is mounted on the CPU. However, finding a suitable TIM2 is not simple. Some of the parameters to benchmark TIM2 include thermal conductivity, thermal interface resistance, bond line thickness, conformity and viscosity. This paper presents a case study that focuses on evaluating the thermal performance of various TIM2 materials and other critical parameters which may need further improvement from supplier's side. This paper provides a methodology for selecting and qualifying a potential TIM2 material for various applications including automotive, servers, personal computers and internet of things.

A streamlined method of TIM2 qualification aligned with product needs was documented in this paper. Materials were analyzed as-received as well as post aging. The results hence include the performance of a TIM2 material after number of years on field. Performance of TIM2 post reliability testing further provided data which extrapolates to number of years on field. Qualitative analysis by visual inspection looking for air gaps, FTIR for organic characterizations post aging vs. as-received determined changes post reliability tests. Thermal performance, chemical nature and morphologies didn't show any effect post shock and vibration. However, post baking differences were seen and documented. Thermo-mechanical studies were performed keeping CPU operating range in mind making sure that those do not affect the TIM2 performances. These results give a fairly straight forward decision making criteria for TIM2 selection.

Initially Published in the SMTA Proceedings

No comments have been submitted to date.
Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search

Program Search
Related Programs
bullet Suggested Stencil Wipe Frequency?
bullet Characterization of SIP Assembly and Reliability Under Thermal Cycles
bullet Development of a Robust 03015 Process
bullet Additive Manufacturing Printed Circuit Board Assembly Processes
bullet Improved SMT and BLR of 0.35 mm Pitch Wafer Level Packages
bullet High-Speed 3D Surface Imaging Technology in Electronics Manufacturing
bullet Gold Stud Bump Flip Chip Bonding on Interconnect Devices
bullet Choosing the Right Stencil Options
bullet Beyond 0402M Placement: Considerations for Microchip Mounting
bullet Investigating the Metric 0201 Assembly Process
More Related Programs