Electronics Assembly Knowledge, Vision & Wisdom
Unlocking The Mystery of Aperture Architecture for Fine Line Printing
Unlocking The Mystery of Aperture Architecture for Fine Line Printing
This paper covers issues of printing for challenging area ratio components and their associated aspect ratio will be investigated.
Production Floor

Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company


Your E-mail


Your Country


Your Comment



Authored By:
Clive Ashmore
ASM Assembly Systems

Summary
The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However, the impending introduction of passive Metric 0201 devices has reopened the need to re-evaluate the printing process and the influence of stencil architecture.

The impact of introducing apertures with architectural dimensions' sub 150um whilst accommodating the requirements of the standard suite of surface mount connectors, passives and integrated circuits will require a greater knowledge of the solder paste printing process.

The dilemma of including the next generation of surface mount devices into this new heterogeneous environment will create area ratio challenges that fall below today's 0.5 threshold. Within this paper the issues of printing challenging area ratio and their associated aspect ratio will be investigated. The findings will be considered against the next generation of surface mount devices.

Conclusions
The findings from this investigation have discovered the following:

The smallest area ratio which can be printed is 0.4.

The aspect ratio has an impact on the Cp value of the print deposition.

An aspect ratio value of 1.6-1.8 produces the most repeatable solder paste deposit.

The findings have recognised that an interaction between both the horizontal/vertical wall surface area and the aperture opening area exists.

M03015 solution with 80um stencil thickness = 180um x 100um (Area Ratio 0.4 and Aspect Ratio 1.8) - Tested

M0201 solution with 60um stencil thickness = 135um x 75um (Area Ratio 0.4 and Aspect Ratio 1.8) - Theoretical

Initially Published in the IPC Proceedings

Comments
No comments have been submitted to date.
Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search


Program Search
Related Programs
bullet Impact of Substrate on Materials Reliability of High Power LED Assemblies
bullet Beyond 0402M Placement: Considerations for Microchip Mounting
bullet Processing Circuit Boards with BGAs On Both Sides
bullet Choosing the Right Stencil Options
bullet Investigation of Copper Sinter Material for Die Attach
bullet Investigation into Printing Miniaturized Devices
bullet Solder Paste Stencil Design for Optimal QFN Reliability
bullet Investigating the Metric 0201 Assembly Process
bullet Challenges of Manufacturing with Printed Circuit Board Cavities
bullet Comparison of Active and Passive Temperature Cycling
More Related Programs