Electronics Assembly Knowledge, Vision & Wisdom
Void-Free Soldering with a New Vapor-Phase with Vacuum Technology
Void-Free Soldering with a New Vapor-Phase with Vacuum Technology
Equipment has been developed to achieve void-free joints under these conditions utilizing modern condensation reflow technology.
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Authored By:
Claus Zabel
Asscon
Konigsbrunn, Germany

JB Byers
A-Tek Systems Group
Longmont, CO, USA

Summary
Voids in solder joints are largely a function of differential pressure between vapor pressure of the gases inside of the joint and environmental conditions. By entering joints still in their liquid state into decompression chambers, voids can be eliminated. Equipment has been developed to achieve void-free joints under these conditions utilizing modern condensation reflow technology.

Initially Published in the SMTA Proceedings

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