Electronics Assembly Knowledge, Vision & Wisdom
Void-Free Soldering with a New Vapor-Phase with Vacuum Technology
Void-Free Soldering with a New Vapor-Phase with Vacuum Technology
Equipment has been developed to achieve void-free joints under these conditions utilizing modern condensation reflow technology.
Production Floor

Authored By:
Claus Zabel
Asscon
Konigsbrunn, Germany

JB Byers
A-Tek Systems Group
Longmont, CO, USA
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Summary
Voids in solder joints are largely a function of differential pressure between vapor pressure of the gases inside of the joint and environmental conditions. By entering joints still in their liquid state into decompression chambers, voids can be eliminated. Equipment has been developed to achieve void-free joints under these conditions utilizing modern condensation reflow technology.
Initially Published in the SMTA Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet Wave Solder Pot Contaminated with Lead
bullet Source of Wave Solder Bridging
bullet Review of Tin-Copper and Tin-Nickel Intermetallic Thickness
bullet Syringe Dispensed Solder Paste for Hand Soldering
bullet Solder Bridging Problem on Header Connector
bullet Selective Soldering for Interconnection Technology
bullet Options for Reducing Dross
bullet Trouble With Skewed DPAK Components
bullet Can Solder Joint Geometry Change Resistance?
bullet What Causes Wave Solder Bridging?
More Related Programs