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SERDP Tin Whisker Testing and ModelingProduction Floor |
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Authored By:Stephan Meschter BAE Systems Endicott, N.Y. Polina Snugovsky, Jeff Kennedy, Zohreh Bagheri, Eva Kosiba Celestica Inc. Toronto, ON, Canada SummaryDriven by European Union directives, most commercial electronics manufacturers began delivering lead-free electronic components, assemblies, and equipment in 2006. As a result of a global movement away from using lead (Pb), component manufacturers are increasingly applying tin-rich finishes to the leads of their devices and soldering with lead(Pb)-free solders. Unfortunately, this can create a risk of tin whisker formation that can result in electrical failures. Motivated by its unique requirements such as long service lifetimes, rugged operating environments, and high consequences of failure, the aerospace and defense industries must mitigate the detrimental effects of tin whisker formation when lead-free materials are used. The present paper provides a status on the effort associated with a multi-year testing and modeling program that aims to assess and quantify tin whisker growth on lead-free manufactured assemblies. The tin whisker growth of tin finished parts soldered with SAC305 (Sn-3.0Ag-0.5Cu) solder alloy under high temperature/high humidity (85 degrees C/ 85 percent relative humidity) conditions were evaluated. Significant whisker growth was observed from the SAC305 solder alloy, particularly in the fillet regions where it was less than 25 microns thick. Details of the sample inspection and whisker growth results are provided. ConclusionsAS-RECEIVED PART FACTORS The lead-free Sn plated parts that meet the typical quality levels in order to form a good solder joint can have microstructural characteristics that may increase whisker formation such as:
WHISKER LENGTH Large whisker growth was observed after exposure to isothermal 85 degrees C/85 percent relative humidity conditions after 1,000 and 4,000 hours. Lead material and contamination level were the most significant factors contributing to whisker growth, while electrical bias had less influence. The following key points can be made:
METALLUGICAL OBSERVATIONS Optical microscopy, scanning electron microscopy in conjunction with cross-section examinations revealed that:
Initially Published in the SMTA Proceedings |
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