Electronics Assembly Knowledge, Vision & Wisdom
Process Control and Reliability of Reworked BGA Solder Joint
Process Control and Reliability of Reworked BGA Solder Joint
This paper discusses the work done in identifying the key features for the right BGA rework equipment.
Production Floor

Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name

Your Company

Your E-mail

Your Country

Your Comment

Authored By:
Adrian Hirceaga
Ishrat Hasan
Creation Technologies
Mississauga, ON, Canada

One of the key aspects in electronics manufacturing is to ensure that the soldering specifications defined by the package manufacturers is fully implemented in production and a process is in place to maintain the reliability and repeatability of soldering. When re-working or replacing a part due to manufacturing or part defect, the work is typically done by hand soldering, a manual process that is then verified by the operator through manual inspection.

In the case of BGA rework, it is a challenge to provide the same level of soldering conditions as the original soldering due to different architecture of the rework equipment. This challenge is further compounded with the smaller footprint packages such as micro BGAs, QFNs and LGAs. Minimal amounts of solder in small packages and handling of parts on the rework equipment reduces the process window. It is important that a process control is in place to maintain the amount of solder paste and suitable reflow condition to ensure a reliable reworked solder joint.

This paper discusses the work done in identifying the key features for the right BGA rework equipment and the aspects important for a reliable and repeatable rework process for BGAs and bottom termination components. The work includes:
  • leaded and lead-free BGAs
  • achieving and replicating reflow conditions of a standard reflow oven in a BGA rework machine
  • working with or without solder paste
  • review of post reflow solder joint analysis

With the introduction of the BGAs and leadless bottom termination components, the BGA rework systems have become a very important piece of equipment which every manufacturer has to depend on, not only for repairing regular fall-out, but increasingly for providing independent localized BGA reflow, when mixed BGA/CSP packages are being used on the same board.

It is very critical to target and achieve higher workmanship standards and a robust, repeatable and reliable rework process for rework of BGA and bottom termination components.

Initially Published in the SMTA Proceedings

No comments have been submitted to date.
Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search

Program Search
Related Programs
bullet Additive Manufacturing-Enabled Wireless Flexible Hybrid Electronics
bullet Best Method for Repairing Underfill Arrays?
bullet Reworkable Edge Bond Adhesives for BGA Applications
bullet Issues With BGA Rework Residue
bullet Through-Hole Rework for Challenging Components
bullet Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
bullet Rework Challenges for Smart Phones and Tablets
bullet Do BGA Components Warp During Reflow?
bullet Calculating Failure Rate During Rework
bullet How To Strip Tin-Lead Solder From SMT Pads for RoHS
More Related Programs