Electronics Assembly Knowledge, Vision & Wisdom
Reliability Improvements by the Creation of Intermetallic Connections
Reliability Improvements by the Creation of Intermetallic Connections
The possibilities to combine small and large passive components, and new devices for active components with an increase in reliability is discussed.
Materials Tech

Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company


Your E-mail


Your Country


Your Comment



Authored By:
Jorg Trodler, Dipl.-Ing.
Heraeus Deutschland GmbH&Co.KG
Hanau, Germany

Dr. Ing. Habil Heinz Wohlrabe
Technical University Dresden
Dresden, Germany

Summary
Especially for the SMT new trends like miniaturization 0201, 01005, 0201 (metrics) for passive components, as well as new devices for actives like LGA or QFN, it requires a lot of investigation for researching, developing, questioning about application, product/component mix, and finally about reliability. One major challenge is the combination of small, medium and large components in one production step. For example, large components need more solder paste, based on a thicker stencil than small components.

Several studies have shown, that properties for reliability at a temperature cycle e.g. -40/+125 prolonged its lifetime by increasing an intermetallic phase (IMP) between substrates and component finishes (e.g. Papers Trodler SMTAi 2012-14). This paper will show and discuss the possibilities by application to combine small and large passive components, and new devices for active components with an increase in reliability, especially for automotive/industry requirements by an IMP formation.

Conclusions
Based on the positive results for reliability and the challenge for more complex boards without using different types of paste (powder size) and stencils, more assembly steps, a project has been started for harmonizing and searching the limits with solder paste and one stencil thickness as well as different openings in the stencil. With those results, the process flow can be described and additional reliability test could be follow to proof an increasing for bigger component as well.

Initially Published in the SMTA Proceedings

Comments
No comments have been submitted to date.
Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search


Program Search
Related Programs
bullet Fill the Void II: An Investigation into Methods of Reducing Voiding
bullet Surface Treatment Enabling Low Temperature Soldering to Aluminum
bullet Behavior of Materials in the Manufacturing Environment
bullet Solder Joint Embrittlement Mechanisms, Solutions and Standards
bullet Issues With Fillets on Via Holes?
bullet Rheology and Wetting Characterizations of Flux and Solder Paste
bullet Challenges for Bottom Termination Components
bullet Converting Cable Assembly to Lead Free Solder
bullet Why is Solder Dross Sticking to Our PCBAs?
bullet Will Nitrogen Reduce Wave Solder Defects?
More Related Programs