Electronics Assembly Knowledge, Vision & Wisdom
A Packaging Physics of Failure Based Testing Methodology
A risk assessment testing methodology built in the fundamentals of packaging physics of failure is discussed in terms of reliability tests.
Analysis Lab

Authored By:
Jingsong Xie and Ming Sun
RelEng Technologies, Inc.
Bethesda, MD, USA

Fei Xie
Engent Inc.
Norcross, GA, USA
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Functional testing is repeatedly performed at several IC part manufacturing stages, from post wafer fabrication to packaging, it is very important to understand its inefficiencies and weaknesses, such as, time zero static electrical functional testing without finding or predicting potential lifetime and operating stress associated quality and reliability issue. Reducing or eliminating these inefficiencies and weaknesses enables an IC part manufacturer to drive down the risk of delivering a bad part or potential a bad part in the lifetime to customers and associated cost of the final product.

It is also important to understand the reason and physics of failure before finalize the testing and quality/reliability assurance flow. In this paper, a risk assessment testing methodology built in the fundamentals of
packaging physics of failure is discussed in terms of reliability tests and package assembly process flows, associated with package structure, bill of materials (BOM) and failure mode effects analysis (FMEA).
In this paper, we have first discussed the failure mechanism and physics based risk assessment methodology and lifetime prediction for new semiconductor packaging in the production quality monitor and lot disposition. Traditional models have been examined and the modification of these models has been proposed to meet the production monitor requirement of the new packaging technologies. Due to the complexity of new packaging technologies, materials and assembly processes, the acceleration factor and time to failure are critical to the risk assessment result and decision of parts shipment.

The adequate selection of a monitoring testing method and fully understanding of testing result and risk assessment based on the physics of failure are not only a pure technical decision, but also, very often, is a serious business decision in the semiconductor parts production, parts shipment and capital investment.

We have then reviewed in details the test assessment, design and implementation issues for enabling IC tests to also serve the reliability assessment purpose. An integration of traditional IC electrical tests and reliability tests can be achieved with theoretical issues being well addressed while with a computer assisted implementation approach yet to be achieved. This study poses a promising practical approach to provide IC designers and providers with potentially much more enhanced reliability assessment information with extensive electrical tests.
Initially Published in the SMTA Proceedings
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