Electronics Assembly Knowledge, Vision & Wisdom
Video Analysis of Solder Paste Release from Stencil Printing
Video Analysis of Solder Paste Release from Stencil Printing
Solder paste release from the stencil is a critical factor in print quality. An experiment used a video microscope to capture the separation of the stencil.
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Authored By:
Chrys Shea, Shea Engineering Services
Burlington, NJ USA

Mike Bixenman, D.B.A. and Wayne Raney, Kyzen Corporation
Nashville, TN

Ray Whittier, Vicor Corporation - VI Chip Division
Andover, MA USA

Summary
Solder paste release from the stencil is a critical factor in print quality, and ultimately, overall electronic product quality and reliability. To better understand release mechanics, an experiment was devised using a video microscope to capture the separation of the stencil from the PCB.

The experiment incorporates different aperture area ratios, solder pastes, stencil nanocoatings and underwipe solvents to visualize their effects on paste release. This study builds on previous research that developed the test setup and recording methods, and incorporates some modifications to the original experimental configuration to improve image quality.

The outputs of the experiments are videos that demonstrate the effects of solder paste formulation, solvent under wiping and nanocoating on paste release at different area ratios. The paper will discuss the observations from the videos, and the presentation will play the videos.

Comments
Why IPA? because!

That is the standard reply to most process related questions.

We've always done it this way is another variation.
Ray Chartrand, CharTrain Consulting
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