Electronics Assembly Knowledge, Vision & Wisdom
Board Level Reliability Comparison of BGA and LGA Packages
Board Level Reliability Comparison of BGA and LGA Packages
Study compares board level reliability of BGA and LGA packages mounted with an LGA footprint. Yield, drop test and thermal performance were evaluated.
Analysis Lab

Authored By:
Robert Darveaux, Howard Chen, Shaul Branchevsky, Bhuvaneshwaran Vijayakumar
Skyworks Solutions, Inc.
Irvine, CA, USA

Ben Zarkoob, Wyatt Huddleston, Christopher J. Berry,
Amkor Technology, Inc.
Chandler, AZ, USA

Fenimore Chen
Integrated Service Technology, Inc.
Hsin-chu City, Taiwan R.O.C.
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Summary
The present study compares board level reliability of both BGA and LGA packages mounted to motherboards with an LGA footprint. SMT yield, drop test performance, and thermal cycle performance were evaluated. Finite element analysis was also used to compare with the measured reliability testing. Both the BGA and LGA devices self-align well without open, shorted, or inconsistent solder joints. The package can be displaced off the pad by no more than 0.200mm, and solder paste misprinting must be limited to 0.050mm. There were no confirmed failures in solder joints up to 3042 temperature cycles.

Simulation predicts that the LGA package should have 1.5X longer fatigue life than the BGA package due to a larger perimeter I/O pads, and additional ground pads in the interior of the module. There were no failures in drop testing up to 400 cycles. Overall, both modules showed excellent board level reliability that far exceeds typical consumer product requirements.
Conclusions
Both the BGA and LGA devices self-align well without open, shorted or inconsistent solder joints. The maximum allowable displacement off the pad is 0.200mm, and solder paste misprinting must be limited to 0.050mm.

There were no confirmed failures in solder joints up to 3042 temperature cycles.

Simulation predicts that the LGA package should have 1.5X longer fatigue life than the BGA package due to a larger perimeter I/O pads, and additional ground pads in the interior of the module.

There were no failures in drop testing up to 400 drop cycles.

Overall, both modules showed excellent board level reliability that far exceeds typical consumer product requirements.
Initially Published in the SMTA Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you attempt to submit information and receive an error, you may need to refresh the page and insert the information again.



Related Programs
bullet On-Board Package Decapsulation Techniques for Failure Analysis
bullet Tools and Techniques for Material Assessment in Advanced Technologies
bullet Mechanical Shock and Drop Reliability Evaluation of the BGA Solder Joint Stack-Ups
bullet PCBA Inspection Concerns
bullet Initial Screen Print Test Board
bullet Novel Pogo-Pin Socket Design for Automated Linearity Testing
bullet Design for Testability to Overcome Functional Board Test Complexities
bullet Revolutionary Technique for Microvia Microsections
bullet Reliability for High Temperature Power Computing
bullet Cross-Sectioning of SMT and PCB Related Architectures
More Related Programs
About | Advertising | Contact | Directory | Directory Search | Directory Submit | Privacy | Programs | Program Search | Sponsorship | Subscribe | Terms

Circuit Insight
6 Liberty Square #2040, Boston MA 02109 USA

Jeff Ferry, Publisher | Ken Cavallaro, Editor/Business Manager

Copyright © Circuitnet LLC. All rights reserved.
A Circuitnet Media Publication