Electronics Assembly Knowledge, Vision & Wisdom
A Novel Conformal Back-Up Material
A Novel Conformal Back-Up Material
Paper presents a new technology and process in mechanical drill backing material designed to be used in rigid multilayer, rigid-flex and flex circuits.
Materials Tech

Authored By:
Rocky Hilburn and Paul St. John
Laminating Company of America (LCOA)
Lake Forest, CA USA
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Summary
Interconnects between layers of circuitry in multilayer printed circuit boards are produced by drilling and plating. Drilling quality can have a major impact on the longevity of the plated interconnect. Mechanical drilling is especially challenged when the printed circuit board panel is not perfectly flat.

Many printed circuit boards (PCBs) contain components and features that create topography that is either expensive or impossible to level out during drilling and other manufacturing processes. A novel material and method have been developed, and benefits demonstrated, that is highly conformable providing a means to produce a level drilling surface without altering or negatively impacting the printed circuit board.

In summary, this paper will present a new technology and process in mechanical drill backing material designed to be used in rigid multilayer, rigid-flex and flexible printed circuits. The features and benefits of the technology will be presented as well as examples showing method of use, a comparison to standard drilling methods and the resulting benefits of using this material.
Conclusions
High topography printed circuits require a backing material to minimize drill burring in order to improve yields in downstream processes.

The newly developed conformal back-up material has conformance characteristics and performance properties that demonstrate the ability to minimize drill burring on high topography printed circuits. See Figure 9 and Figure 10 for results of exit burr reduction using the conformal backup.

The materials used will not contaminate the drilled hole and any debris from the drill process is removed using standard cleaning methods already used at the PCB manufacturer.
Initially Published in the IPC Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet Tin Whisker Risk Management by Conformal Coating
bullet A Novel Conformal Back-Up Material
bullet Shelf Life Before Conformal Coating
bullet Evaluation and Qualification of Reworkable Underfill Materials
bullet Exploring the Reliability Limits for Silicone Adhesives
bullet Ultrathin Fluoropolymer Coatings to Mitigate PCB Damage
bullet Hybrid Conformal Coatings Used for Mitigating Whisker Growth
bullet Issues Mixing Silicone and Acrylic Conformal Coatings
bullet Reterminated RoHS Components for SnPb Applications
bullet Un-cleaned PCB Assemblies Potted
More Related Programs