Electronics Assembly Knowledge, Vision & Wisdom
The Effects of PCB Fabrication on High-Frequency Electrical Performance
The Effects of PCB Fabrication on High-Frequency Electrical Performance
Achieving optimum high-frequency PCB performance is not only the best possible PCB material, but can be impacted by PCB fabrication practices.
Materials Tech

Authored By:
John Coonrod
Rogers Corporation
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Summary
Achieving optimum high-frequency printed-circuit-board (PCB) performance is not simply a matter of specifying the best possible PCB material, but can be significantly impacted by PCB fabrication practices. In addition to appropriate circuit materials and circuit design configurations to meet target performance goals, a number of PCB material-related issues can affect final performance, including the use of soldermask, the PCB copper plating thickness, the conductor trapezoidal effect, and plating finish; understanding the effects of these material issues can help when fabricating high-frequency circuits for the best possible electrical performance.

Many PCB applications use soldermask as a thin coating to prevent the adhesion of solder to different sections of a PCB, although it may be surprising to those not working with PCBs at higher frequencies to find that these circuits are formed without soldermask, or that it is used only sparingly for high-frequency PCBs. High-frequency PCBs are often multilayer constructions employing a combination of materials and circuit configurations. For high-frequency PCBs, it is not uncommon to have outer copper circuit layers consisting of microstrip circuits or grounded coplanar circuit constructions as shown in figure 1.
Initially Published in the IPC Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet Calculating PCB Hole Diameters
bullet Electroplated Copper Filling of Through Holes
bullet Study of Various PCBA Surface Finishes
bullet Rigid-Flex PCB Right the First Time - Without Paper Dolls
bullet Micro Trace Resistive Technology
bullet Bottom Terminated Components and Vias
bullet Reliability of ENEPIG by Sequential Thermal Cycling and Aging
bullet Simulation of Embedded Component
bullet What is Causing Dimples in Blind Via Pads?
bullet How Do You Remove Oxidation from PCBs?
More Related Programs