Electronics Assembly Knowledge, Vision & Wisdom
Methods to Get Volatile Compounds Out of Reflow Process
Methods to Get Volatile Compounds Out of Reflow Process
With the introduction of lead-free soldering operating temperatures increased, and the chemistry of solder paste has been modified.
Production Floor

Authored By:
Gerjan Diepstraten
Vitronics Soltec B.V.
Oosterhout, Netherlands
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free soldering not only operation temperatures increased, but also the chemistry of the solder paste was modified to meet the higher thermal requirements. Miniaturization is a second factor that impacts the reflow process.

The density on the assembly is increasing where solder paste deposit volumes decreases due to smaller pad and component dimensions. Pick and place machines can handle more components and to meet this high through put some SMD lines are equipped with dual lane conveyors, doubling solder paste consumption. With the introduction of pin in paste to solder through hole components contamination of the oven increased due to dripping of the paste.
The first phase of implementation is to install the prototype flux collection unit to a test oven. Temperatures and gas flows will be measured to have the ideal exhaust conditions for the process gas. Different flux chemistries will be run through the oven in order to quantify the efficiency of the different catalyst and granulate materials before the unit will be installed on a production line to investigate the impact on maintenance.

Different granulates will be benchmarked to identify performance of a pyrolysis process. Two catalysts will be evaluated to see if a catalyst oxidation process is a more efficient way to clean ovens.
Initially Published in the IPC Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name






Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.

Related Programs
bullet Void-Free Soldering With Vapor-Phase Vacuum Tech
bullet How to Reduce Voiding on QFN Components
bullet Is There A Need for Reflow Profiles
bullet Vapour Phase - Profiling for Lead-Free Alloys
bullet Pin-in-Paste Calculations
bullet Why Do Our Boards Warp During Reflow?
bullet Micro Solder Balls Problem
bullet What Causes Chip Blow Off During Reflow?
bullet Tips When Moving a Reflow Oven
bullet Reflow Causing Warp
More Related Programs