Electronics Assembly Knowledge, Vision & Wisdom
 Mitigating Tin Whiskers in Alternative Lead-Free Alloys
Mitigating Tin Whiskers in Alternative Lead-Free Alloys
As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry.
Analysis Lab

Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
Authored By:
Karl F. Seelig
AIM
Cranston, RI USA


Summary
As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry. Current research shows that there is no perfect alloy for all cases of electronic usage. Industry leaders and researchers continue to study and search for a lead free alloy that is able to withstand harsh environments while maintaining high reliability.

Conclusions
Based on the above work, further research is necessary. As evidenced in this paper, it is likely that tin whiskers can be mitigated by alloy additions and acceptable physical properties can be achieved for high reliability alloys.

Initially Published in the IPC Proceedings

No comments have been submitted to date.
Submit A Comment
Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet Can Water Contamination Cause Failure?
bullet Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
bullet Analysis of Laminate Material Properties for Correlation to Pad Cratering
bullet Novel Approaches for Minimizing Pad Cratering
bullet Acceptable Rate for Head in Pillow?
bullet Testing PCBs for Creep Corrosion
bullet Mitigating Tin Whiskers in Alternative Lead-Free Alloys
bullet Human-Induced Contamination on PCB Assembly
bullet We Bake, But Still Have Delamination, Why?
bullet Influence of Salt Residues on BGA Head in Pillow
More Related Programs