Electronics Assembly Knowledge, Vision & Wisdom
New High-Performance Organophosphorus Flame Retardant
New High-Performance Organophosphorus Flame Retardant
A non-halogen flame retardant has been developed for high performance applications. Resin performance data are presented.
Materials Tech

Authored By:
Kimberly M. White, Ph.D., Daniel De Schryver, Ph.D., and Randy Chaya
Albemarle Corporation
Baton Rouge, Louisiana
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Summary
A new non-halogen flame retardant has been developed and is useful for a variety of high performance applications. This non-reactive phosphorus-based material satisfies fire safety needs for a broad range of resins including epoxy, polyolefin, and polyamide.

The combination of excellent flame retardant efficiency, high thermal stability and exceptional electrical properties is unique to this organophosphorus flame retardant and makes it a breakthrough technology for high speed, high frequency use in fast growing wireless and wired infrastructures. Resin performance data, including formulations with synergists, are presented in this paper.
Conclusions
As technology progresses, so does the need for advanced materials. Anticipating this need, this material was developed as a high performance non-halogenated flame retardant technology. This new flame retardant can be processed at high temperatures and has a unique combination of high flame retardant efficiency, high thermal stability and superior electrical properties.

It can be applied in many different resin systems such as those used in printed circuit boards, aerospace, films and fibers, wire and cable, and connector applications. With a high melting point, it is melt blendable in applications where resins are processed at high temperature. The performance characteristics of this flame retardant make it attractive for a broad range of applications.
Initially Published in the IPC Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet Embedded Components: A Comparative Analysis of Reliability
bullet New High-Performance Organophosphorus Flame Retardant
bullet Is HASL a Good Choice for Surface Finish?
bullet Challenges on ENEPIG Finished PCBs
bullet MELF Component Misalignment
bullet Examination of Glass-fiber and Epoxy Interface Degradation in Circuit Boards
bullet Influence of Copper Conductor Surface Treatment for High Frequency PCB
bullet Connector Design for Wearables
bullet Semi-Additive Process for High Frequency Signal Substrates
bullet Dielectrics for Embedding Active and Passive Components
More Related Programs