Electronics Assembly Knowledge, Vision & Wisdom
Electrical Testing of Passive Components
Electrical Testing of Passive Components
Substrates have become more critical with regard to pitch and density leading to increased use of buried components. This paper reviews testing for buried capacitors.
Production Floor

Authored By:
Todd L Kolmodin, Howard Carpenter
Gardien Services USA

Manfred Ludwig
Gardien Services China
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Summary
Substrates have become more critical with regard to pitch and density in today's designs with challenges for passive components in terms of surface placement. This negates the opportunity for high speed, high cost components to be placed on the surfaces of the PCB. With this the capacitance and resistive components have to be embedded into the design.

This has been accomplished with the advent of buried capacitance cores and buried resistors. Unfortunately this has caused some challenges to the ET Test Centers/Labs in the ability to effectively test these buried passive components. Processes have had to change and adapt to these new technologies. The paper will discuss what these new technologies are and how the Electrical Test arena has adapted to provide accurate testing of the buried resistors and accommodate the buried capacitive cores to not receive false errors from the Grid Testers and Flying Probes.
Conclusions
As technology grows and PCB sizes shrink the demand for embedded technologies will only grow. Many end-users are designing embedded passives into their products and the Electrical Test community is expected to provide the test solutions for these new powerful designs. The use of buried resistors is increasing and care must be taken to identify these components during the ET CAM process so that the test machines are aware of them and do not overpower them with standard test parameters.

For the design community that uses the buried core technology the manufacturers of this material have always recommended using the largest configuration for the buried resistor as feasible. As noted previously the "square" should be as large as feasible to provide the required resistance while also maintaining the optimum power dissipation level to ensure long life and stability.

Buried capacitance has been around for a long time but is also increasing. The ability for Electrical Test to accurately test this type of product is crucial. Accurately identifying and allowing the buried capacitance component, results in improved throughput and delivery. It also reduces unnecessary delays, troubleshooting and unfortunate scrap of product that is actually good.
Initially Published in the IPC Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet What is Kelvin Test?
bullet Thermal Cycle Testing of PWBs
bullet Good Quality Comes From Good Design for Test
bullet Drop Test For Lead-Free Assemblies
bullet Electrical Testing of Passive Components
bullet Head in Pillow X-ray Inspection at Flextronics
bullet Embedded System Access
bullet The Evolution of ICT
bullet Voiding Control at QFN Assembly
bullet Flexible Fixturing System for In-Circuit Test
More Related Programs
About | Advertising | Contact | Directory | Directory Search | Directory Submit | Privacy | Programs | Program Search | Sponsorship | Subscribe | Terms

Circuit Insight
6 Liberty Square #2040, Boston MA 02109 USA

Jeff Ferry, Publisher | Ken Cavallaro, Editor/Business Manager

Copyright © Circuitnet LLC. All rights reserved.
A Circuitnet Media Publication