Electronics Assembly Knowledge, Vision & Wisdom
Embedded Components: A Comparative Analysis of Reliability
Embedded Components: A Comparative Analysis of Reliability
Paper covers a series of comparative analyses, testing the reliability of standard SMT components vs their embedded counterparts.
Materials Tech

Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company


Your E-mail


Your Country


Your Comment



Authored By:
Guenther Mayr
AT&S AG

Summary
In light of new process and product technologies in the field of embedded components, questions arise with respect to advantages and potential disadvantages to standard SMT component placement when considering reliability.

This paper is the second part in a progressively complex series of comparative analyses, testing the reliability of standard SMT components in comparison to their embedded counterparts.

In the initial round of comparative tests, we analyzed passive components. In this second part we will compare the performance of similarly specified embedded dies and standard surface mounted CSPs which are designed to simulate an active component ("dummies") in terms of interconnectivity.

The applied reliability tests shall include:
Drop Test per JEDEC JESD22-B111: 1500g / 0.5ms
Thermal cycle testing (TCT) per JEDEC JESD22-A104: -40 degrees C / +125 degrees C
Bend Testing - Based on the IPC/JEDEC 9702 (Monotonic Bend Characterization of Board-Level Interconnects)

With these tests, as with the initial paper on embedded passives, we aim to define possible limitations, advantages, disadvantages and areas of functional application which are relevant to this direct comparison. With the addition in this study of one mechanical bend test we hope to introduce a more well-rounded picture of the reliability one should expect for different instances and component placement methodologies.

As the usage, as well as fields of application, of embedded components increases in part due to more stable and refined methods of manufacturing, it is worthwhile to examine them based on industry norms and standards as a source of comparison to traditional manufacturing methods. Part of this analysis is therefore to investigate the feasibility of employing such standards in the context of embedded components. This investigation, in turn, should offer us a holistic perspective to other current industry projects, such as the EU-funded "Hermes".

Conclusions
To summarize, there were visible reliability advantages for embedded components under the production and testing methods described. These advantages, at least with these components and array, are mainly found in the reduction of deviation to a rigid board's neutral axis. In terms of thermal reliability we did see clear advantages for ECs versus SMD.

Initially Published in the IPC Proceedings

Comments
No comments have been submitted to date.
Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search


Program Search
Related Programs
bullet Insulation Resistance of Dielectric Materials
bullet Is HASL a Good Choice for Surface Finish?
bullet Board Processes and Effects on Fine Copper Barrel Cracks
bullet Long Term Thermal Reliability of Printed Circuit Board Materials
bullet Final Finish Specifications Review
bullet Embedded Components: A Comparative Analysis of Reliability
bullet Study of Various PCBA Surface Finishes
bullet New High-Performance Organophosphorus Flame Retardant
bullet Simulation of Embedded Component
bullet The Effect of Radiation Losses on High Frequency PCB Performance
More Related Programs