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Beyond 0402M Placement: Considerations for Microchip Mounting
Beyond 0402M Placement: Considerations for Microchip Mounting
This presentation explores board and component trends, and delves into three areas for successful 03015M adoption: equipment, materials, and controls.
Production Floor

Authored By:
Brent Fischthal, Michael Cieslinski
Panasonic Factory Solutions Company of America, Illinois USA
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Summary
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm 0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization.

This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
Conclusions
With the upsurge in miniature, lightweight, advanced-function electronic devices, demand will drive an increase in microchip adoption that will necessarily result in improved practices in manufacturing. The mounting technology for 03015M components requires some of the same principles as the larger 0603M (0201) and 0402M (01005) microchips; yet, certain machine features are becoming necessary to ensure high quality production. Even with a capable machine, component placement is only part of the process.

Manufactures must give additional, special consideration to board design, tape standards, solder materials, and stencil design. Certain manufacturing enhancements like Adaptive Process Control can help manufacturers improve yields for microchip. For its part, the company intends to continue evaluating these and other new products to ensure manufactures have the solutions to address mounting challenges likely to arise as the microchip trend progresses. After all, the 0201M chip component is already in the design phase.
Initially Published in the IPC Proceedings
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