Electronics Assembly Knowledge, Vision & Wisdom
Optimizing Insulated Metal Substrate Application
Optimizing Insulated Metal Substrate Application
The growth in the use of insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application.
Materials Tech

Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company


Your E-mail


Your Country


Your Comment



Authored By:
Dave Sommervold, Chris Parker, Steve Taylor, Garry Wexler
The Bergquist Company
Prescott, WI USA

Summary
The ever expanding growth in the use of insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application. By optimizing the material makeup and printed board format, performance and reliability expectations can be further achieved. The thermal performance and electrical isolation needs are driven by the power requirements, but considerations of temperature range, mechanical durability and format, along with the physical package surrounding the substrate must also be managed.

With a variety of material configurations and circuit format capabilities, the choices become a balancing of options to maximize performance and minimizing cost through Design For Manufacturability (DFM) in the circuit board fabrication. These challenges present the IMS printed board fabricator with material selections and fabrication processes unlike those for other printed board or ceramic applications.


Conclusions
IMS substrates provide many advantages in power electronics and LED designs with the variety of material selections and circuit fabrication possibilities, examples shown in figure 5. The design does need to narrow down the choices of material configurations to meet performance and price requirements. Matching thermal performance, safety agency testing needs and best fabrication method can be greatly enhanced with a strong technical relationship with the material/fabricator vendor.

With the continued increases in power density and the exploding LED lightning market, more and more designers will have to look to IMS substrates for their applications needs. However the amount of differentiation from traditional FR-4 fabrication forces the need apply design practices not previously considered.

Comments
No comments have been submitted to date.
Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search


Program Search
Related Programs
bullet Insulation Resistance of Dielectric Materials
bullet Is HASL a Good Choice for Surface Finish?
bullet Board Processes and Effects on Fine Copper Barrel Cracks
bullet Long Term Thermal Reliability of Printed Circuit Board Materials
bullet Final Finish Specifications Review
bullet Embedded Components: A Comparative Analysis of Reliability
bullet Study of Various PCBA Surface Finishes
bullet New High-Performance Organophosphorus Flame Retardant
bullet Simulation of Embedded Component
bullet The Effect of Radiation Losses on High Frequency PCB Performance
More Related Programs