Electronics Assembly Knowledge, Vision & Wisdom
Optimizing Insulated Metal Substrate Application
Optimizing Insulated Metal Substrate Application
The growth in the use of insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application.
Materials Tech

Authored By:
Dave Sommervold, Chris Parker, Steve Taylor, Garry Wexler
The Bergquist Company
Prescott, WI USA
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
The ever expanding growth in the use of insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application. By optimizing the material makeup and printed board format, performance and reliability expectations can be further achieved. The thermal performance and electrical isolation needs are driven by the power requirements, but considerations of temperature range, mechanical durability and format, along with the physical package surrounding the substrate must also be managed.

With a variety of material configurations and circuit format capabilities, the choices become a balancing of options to maximize performance and minimizing cost through Design For Manufacturability (DFM) in the circuit board fabrication. These challenges present the IMS printed board fabricator with material selections and fabrication processes unlike those for other printed board or ceramic applications.
IMS substrates provide many advantages in power electronics and LED designs with the variety of material selections and circuit fabrication possibilities, examples shown in figure 5. The design does need to narrow down the choices of material configurations to meet performance and price requirements. Matching thermal performance, safety agency testing needs and best fabrication method can be greatly enhanced with a strong technical relationship with the material/fabricator vendor.

With the continued increases in power density and the exploding LED lightning market, more and more designers will have to look to IMS substrates for their applications needs. However the amount of differentiation from traditional FR-4 fabrication forces the need apply design practices not previously considered.
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name






Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.

Related Programs
bullet Connector Design for Wearables
bullet Semi-Additive Process for High Frequency Signal Substrates
bullet BTC-QFN Test Board Design for Qualifying Soldering Materials
bullet Is HASL a Good Choice for Surface Finish?
bullet Dielectrics for Embedding Active and Passive Components
bullet Board Level Failure Analysis Demount Challenges Package Package
bullet Circuit Material Performance for PCBs at Millimeter Wave Frequencies
bullet Electroplating of Cu in TSV
bullet Design and Fabrication of Ultra-Thin Flexible Substrate
bullet Young Laplace Equation Reveals New Possibilities Thermal Pad Design
More Related Programs