Electronics Assembly Knowledge, Vision & Wisdom
Dielectrics for Embedding Active and Passive Components
Dielectrics for Embedding Active and Passive Components
This paper presents a composite type material that can be used as dielectric for the embedding of actives and passives.
Materials Tech

Authored By:
J. Kress, R. Park, A. Bruderer, and N. Galster
Atotech Deutschland GmbH
Basle, Switzerland

SH Cho
Dongyang Mirae University
Seoul, Korea
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Summary
Embedding of actives and passives is a quickly growing field which is being investigated by many companies and institutes. Reasons for this increasing interest are to reduce the complexity of the packages, achievement of higher degree of miniaturization, shorter electrical connections, and a reduction of layer count.

Among other technical challenges, warpage is a major concern. The inherent different thermomechanical properties of the different materials involved cause internal stresses. Those stresses show up as warpage which makes handling during production more difficult, reduces the overall yield, and imparts reliability.

Presented in this paper is a composite type material which can be used as dielectric for the embedding of actives and passives. It combines the advantages of the mechanical stability of prepregs and the good encapsulation properties and ease of handling of resin coated copper foils (RCC). Also described is a concept for simulating the warpage of packages using such composite build-up materials taking into account different resin properties.
Conclusions
New material types can help to overcome some of the challenges of embedding technologies. We presented a type of composite resin material consisting of two distinct dielectric layers which are attached to a carrier foil. In a solvent free manufacturing, ultrathin glass fabrics can be easily employed and relatively thick resin layers for embedding can be created. Such a material combines the advantages of a prepreg (mechanical stability) with the advantages of an RCC (encapsulation properties). The thickness distribution above the dies is excellent which is important for reliable laser drilling processes.

A study was initiated in which the warpage is to be predicted for a defined chip layout and a defined set of material properties. The results of this investigation might allow to minimize warpage for a given layout by adjusting the material properties of the individual layers of the composite.
Initially Published in the SMTA Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet Young Laplace Equation Reveals New Possibilities Thermal Pad Design
bullet Embedded Components: A Comparative Analysis of Reliability
bullet New High-Performance Organophosphorus Flame Retardant
bullet Is HASL a Good Choice for Surface Finish?
bullet Challenges on ENEPIG Finished PCBs
bullet MELF Component Misalignment
bullet Examination of Glass-fiber and Epoxy Interface Degradation in Circuit Boards
bullet Influence of Copper Conductor Surface Treatment for High Frequency PCB
bullet Connector Design for Wearables
bullet Semi-Additive Process for High Frequency Signal Substrates
More Related Programs