Electronics Assembly Knowledge, Vision & Wisdom
Alternatives to Solder in Packaging and Assembly
Alternatives to Solder in Packaging and Assembly
This presentation surveys the landscape of alternatives to solder in interconnect, packaging, and assembly.
Materials Tech

Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company


Your E-mail


Your Country


Your Comment



Authored By:
Herbert J. Neuhaus, Ph.D., and Charles E. Bauer, Ph.D.
TechLead Corporation
Portland, OR, USA

Summary
Solder plays a special role in the world of electronics manufacturing as evidenced by the disruptive nature of the lead-free movement. The intense search for attractive leadfree solders reveals the preeminent importance of solder to the industry. In fact, solder consumes so much attention that solder-less alternatives are often overlooked.

Material-based alternatives to solder include conductive adhesives and transient-phase compounds. Developments in nanotechnology spawned a virtual renaissance in conductive adhesives and other solder-less joining materials.

As a complement to the solder-less materials developments, embedded assemblies use conventional materials in novel ways to improve performance by cutting interconnect parasitics and increase reliability gains by eliminating wirebonds and solder-bumps. Freescale, Imbera, GE, Verdant, and many others develop and employ diverse approaches to embedding active devices.

Particle Interconnect represents another solder alternative. While originally developed for automated test, particle interconnect holds considerable promise in a variety of applications including LED assembly and printed electronics.

This presentation surveys the landscape of alternatives to solder in interconnect, packaging, and assembly. Next, the presentation treats practical implementation challenges such as yield management strategies and supply chain restructuring. Finally, the presentation concludes with a discussion of scenarios in which older alternatives offer highly compelling business and technical benefits.


Conclusions
The disruptive nature of the effort to replace lead-based solders reveals the central role played by solder in electronics assembly. Lead-free solders require higher temperatures and increase the thermal tolerance requirements of electronic components. As a result, the industry has become increasingly open to solder-less alternatives.

TechLead has identified three broad families of solder alternatives: materials-based, process-based, and structurebased. Each family enjoys renewed interest and new applications. As with many disruptive technologies, the need for some supply chain restructuring limits adoption. However, TechLead forecasts that demand for performance and reliability will overcome adoption barriers.



Initially Published in the SMTA Proceedings

Comments
No comments have been submitted to date.
Free Newsletter Subscription
Every issue of the Circuit Insight email newsletter will bring you the latest information on the issues affecting you and your company.

Insert Your Email Address

Directory Search


Program Search
Related Programs
bullet The Effects of Phosphorus in Lead-Free Solders
bullet Grain Refinement for Improved Lead-Free Joint Reliability
bullet Reliability of No-clean and Water-soluble Solder Pastes
bullet Effect of Bi Content on Properties of Low Silver SAC Solders
bullet Improving properties of a Lead-free Solder Alloy with Doping of Copper
bullet Mixed Metals Impact on Reliability
bullet New Requirements for Sir Measurement
bullet Testing Intermetallic Fragility
bullet Alternatives to Solder in Packaging and Assembly
bullet Microalloyed Sn-Cu Pb-Free Solder for High Temp
More Related Programs