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Double Print Stencils Systems
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Authored By:William E. Coleman Photo Stencil Colorado Springs, CO SummaryThe Two print stencils process has been a very useful tool in SMT Assembly and Package Assembly. It is also useful in Assemblies that require mixed technologies; including SMT / Through Hole, SMT / Glue attach components, Packages requiring die attach / SMT assembly. The concept is to print with a first print stencil which is thinner than the second print stencil. The second print stencil has relief pockets formed anywhere that the first stencil printed. It is useful for several applications: Printing Solder Paste for Through-Hole and SMT Printing Glue and Solder Paste Printing Flux and Solder Paste Printing Solder Paste for SMT and RF Shields Printing Reservoir Solder Paste for multi-level boards Printing Solder Paste and Reservoir Flux ConclusionsThe Two Print Stencil System has demonstrated an effective printing process for Surface Mount Assembly Including: Through Hole / SMT Assembly SMT / Flip Chip Assembly FR Shield / SMT Assembly SMT / Glue Chip Component Assembly Multi-Level SMT Assembly 01005 / Die Attach Assembly Other applications not mentioned in this paper including printing lead free and tin lead on the same PCB. Initially Published in the IPC Proceedings |
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