Research
Fill the Void II: An Investigation into Methods of Reducing Voiding
Final Finish Specifications Review
DFX on High Density Assemblies
Challenges on ENEPIG Finished PCBs
Testing PCBs for Creep Corrosion
Screening of Lower Melting Point Pb-Free Alloys
Hand Printing using Nanocoated and other High End Stencil Materials
Board Processes and Effects on Fine Copper Barrel Cracks
MORE RESEARCH
Latest Industry News
Soldiers could teach future robots how to outperform humans
The iPhone is still breaking sales records during the pandemic
Foxconn says China can no longer be "the world's factory"
The Counterintuitive Way Social Media Can Reduce Stress
Do Engineers Live Longer? A Look at Occupational Factors’ Effect on Longevity
How to Work from Home Successfully
Smartphone shipments in China plunge 35% in July: government data
China handset players launch 5G phones in Taiwan
MORE INDUSTRY NEWS

Printed Circuit Structures, the Evolution of Printed Circuit Boards



Printed Circuit Structures, the Evolution of Printed Circuit Boards
The PCS concept will allow passives, actives and even antennas to move out of the XY plane and into the XZ and YZ planes.
Materials Tech

DOWNLOAD

Authored By:


Kenneth H. Church, Harvey Tsang, Ricardo Rodriguez, Paul Defembaugh
nScrypt, Inc., Orlando, FL USA

The University of Texas at El Paso
El Paso, TX USA

Summary


The Printed Circuit Board (PCB) is the backbone of electronics and a large number of consumer devices. The challenge to put more function in a smaller space requires more components utilizing smaller bond pads, smaller lines and tighter pitch. The electronic packaging industry has aggressively pursued novel ways to shrink and stack multilayer boards inside smaller volumes. Industry is approaching serious obstacles in the continued size reduction requirements with the need for wires, epoxy, vias, solder and sometimes bolts and screws to mount the boards.

The next logical step is to move beyond 2D stacking, which is 2.5D to make 3D packages and to utilize the 3rd dimension directly. Eliminate the traditional 2D FR4 board and the wires, epoxies, vias and solder and make the next generation packages utilizing the 3rd dimension; the Printed Circuit Structure (PCS).

The PCS concept will allow passives, actives and even antennas to move out of the XY plane and into the XZ and YZ planes. This new dimension will appear to be very complex and next generation circuit optimization will be required, but the end result will net a significant improvement in volume utilization. In addition, if new materials are developed and utilized properly, the PCS will be the box or the package thus eliminating all the bolts and screws necessary to mount a PCB in a traditional box or package, thus again saving space and reducing weight.

nScrypt and the University of Texas at El Paso will present 3D Printing of Printed Circuit Structures. A demonstration of true 3D electronic structures will be demonstrated and shown as well novel approaches which utilize Computer Aided Design (CAD) to 3D Printing which will include the electronics portion.

Conclusions


DPAM is able to combine 3D printing's structures with printed electronics' funct ionality at the resolution of DP. But it is still early, requiring labor intensive procedures that take time to produce the desired products and the desired automation that current 3D printers have achieved. While 3D printing has been around for more than three decades, DPAM has been around for less than one.

The future of PCB will be heterogeneous printing thus enabling a new generation of electronic packaging. Future work for this will be in material research to functionally load materials for specific mechanical and electrical properties that promote 3D building. Additionally, new processes will be important to achieve proper features during printing; surface roughness or excess voids will need to be controlled. The DPAM process has not been fully studied nor optimized and this will be important.


Initially Published in the IPC Proceedings

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Board Talk
Cleaning Reballed BGA Components
We Bake, But Still Have Delamination, Why?
Reflow For Rigid Flex
Solder Paste Volume for BGA Rework
Problems With Starved "J" Lead Joints
Delay Before Cleaning Partial Assemblies
Can a CTE Mismatch Cause Reliability Problems?
Solder Paste Transfer Efficiency - What/Why
MORE BOARD TALK
Ask the Experts
Soldering Components with Silver Pads
Environment Impact on Assembly, Printing and Reflow
Solder Balling Prediction Formula
Old Components and Blow Holes
Estimating Failure Rate During Rework
Coating to stop tin whisker growth?
Cleaning an assembled board with IPA
Remove and replace a 240 pin connector
MORE ASK THE EXPERTS