Electronics Assembly Knowledge, Vision & Wisdom
Printing and Assembly Challenges for QFN Devices
Printing and Assembly Challenges for QFN Devices
QFN (quad flatpack, no leads) and DFN (dual flatpack, no lead) are becoming more popular in new component releases.
Production Floor

Authored By:
Rachel Short
Photo Stencil, Colorado Springs, CO USA
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Conclusions
Although QFN devices present a challenge to the SMT assembly process with proper stencil design, proper stencil technology selection (Laser, Electroform, Nano-Coat), and proper PCB solder mask layout these challenges can be overcome. The most popular QFN repair seems to be to print solder paste directly onto the QFN leads and ground plane.
Initially Published in the IPC Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet Screen Making for Printed Electronics
bullet Digitally Printed Battery Design
bullet Is There a Limit to the Step in a Step Stencil?
bullet Printing vs. Dispensing
bullet Optimization of Stencil Apertures to Compensate for Scooping
bullet How Effective Is Nano Coating On Stencils?
bullet Solution for Grape Effect
bullet Wearable Electronics & Big Data = High Volume, High Mix SMT
bullet 01005 Component Challenges and Bugs
bullet Bottom Side Chip Bonding
More Related Programs