Electronics Assembly Knowledge, Vision & Wisdom
Printing and Assembly Challenges for QFN Devices
Printing and Assembly Challenges for QFN Devices
QFN (quad flatpack, no leads) and DFN (dual flatpack, no lead) are becoming more popular in new component releases.
Production Floor

Authored By:
Rachel Short
Photo Stencil, Colorado Springs, CO USA
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Although QFN devices present a challenge to the SMT assembly process with proper stencil design, proper stencil technology selection (Laser, Electroform, Nano-Coat), and proper PCB solder mask layout these challenges can be overcome. The most popular QFN repair seems to be to print solder paste directly onto the QFN leads and ground plane.
Initially Published in the IPC Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name






Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.

Related Programs
bullet How Many Fiducials Per Stencil
bullet Control of the Underfill of Surface Mount Assemblies
bullet Reliability Study of Bottom Terminated Components
bullet 3D Assembly Processes a Look at Today and Tomorrow
bullet The Challenges of LGA Server Socket Trends
bullet Selecting Stencil Technologies to Optimize Print Performance
bullet Solder Paste Transfer Efficiency - What/Why
bullet Going Beyond Your Solder Paste Work Life
bullet Problems With Starved "J" Lead Joints
bullet Cause of Damage During Through-hole Component Insertion
More Related Programs