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The Dynamics of Low Stress Epoxy Curing
Effect of EPIG Plating Thicknesses on Solder Joint and Wire Bond Reliability
Cu Conductive Paste as Via Filling Materials for Various Substrates
Cohesive Zone Modeling of Failure Underfilled BGA-PCB Assemblies
Lessons Learned While Investigating Microvia Reliability Failures
Insulation Resistance of Dielectric Materials
Assembly Process Feasibility of Low Silver Solder Paste
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
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Insertion Loss Comparisons of High Frequency PCBs
PCBs have been used for many years in low loss, high frequency microwave applications and many have become increasingly complex.
Materials Tech
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Authored By:
John Coonrod, Rogers Corporation
Initially Published in the IPC Proceedings
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