Electronics Assembly Knowledge, Vision & Wisdom
Direct Determination of Phosphorus Content in Electroless Nickel Plating
Direct Determination of Phosphorus Content in Electroless Nickel Plating
Developments in XRF instrument hardware and software have extended the measurement application of electroless plating processes to nearly any substrate.
Analysis Lab

Authored By:
Michael Haller
Jim Bogert, Ryan Boyle
Fischer Technology, Windsor CT, USA

Volker Rößiger, Wolfgang Klöck
Helmut Fischer GmbH, Sindelfingen, Germany
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Electroless plating processes are popular because of their performance, reliability and cost effectiveness. The process combines unique deposit properties such as uniform plating build up regardless of geometry, excellent corrosion resistance, superior hardness and wear and the ability to plate on non-conducting materials. The most commonly used electroless plating process is Electroless Nickel (EN) plating using nickel phosphorus baths.

The phosphorus content plays a fundamental role in all physical properties of the deposit. It is, therefore, critical to control the phosphorus content within a relatively tight range. X-ray fluorescence is an excellent method to not only measure plating thickness but also weight percent elemental composition of coatings. Previously, it was only possible to measure plated phosphorus content on steel substrates. New developments in XRF instrument hardware and software have extended the measurement application of electroless plating processes to nearly any substrate. The simultaneous measurement of thickness and composition is critical.
New developments in XRF hardware and software technology have made it possible to simultaneously measure % phosphorous and NiP coating thickness in air. Being able to measure the phosphorous content directly now allows determination of the % phosphorous in electroless Ni-plantings on substrates in addition to iron, such as, Al or even non metallic substrates. Instruments with SDDs can measure the P-K radiation quite well using soft primary excitation (10 kV, non-filtered). Coating thickness is determined using harder excitation (30 keV or 50 kV).

The information depth for phosphorus is relatively low (<1 m) due to the low energy of P-K fluorescence. Conventional indirect determination of phosphorus can still be regarded as a relatively robust method with proportional counter tube instruments - the only option with these instruments.
Initially Published in the IPC Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name






Please type the number displayed into the box. If you attempt to submit information and receive an error, you may need to refresh the page and insert the information again.

Related Programs
bullet Electroplated Copper Filling of Through Holes
bullet MELF Component Misalignment
bullet Qualification of Thin Form Factor PWBs
bullet Corrosion Resistance of Finishes in Harsh Environments
bullet Dielectrics for Embedding Active and Passive Components
bullet Design and Fabrication of Ultra-Thin Flexible Substrate
bullet Examination of Glass-fiber and Epoxy Interface Degradation in Circuit Boards
bullet Rigid-Flex PCB Right the First Time - Without Paper Dolls
bullet Imbedded Components: Ready for Mainstream?
bullet Evaluation of Laminates for Pb-free HASL Process
More Related Programs
About | Advertising | Contact | Directory | Directory Search | Directory Submit | Privacy | Programs | Program Search | Sponsorship | Subscribe | Terms

Circuit Insight
6 Liberty Square #2040, Boston MA 02109 USA

Jeff Ferry, Publisher | Ken Cavallaro, Editor/Business Manager

Copyright © Circuitnet LLC. All rights reserved.
A Circuitnet Media Publication