Electronics Assembly Knowledge, Vision & Wisdom
Cost Effective 3D Glass Microfabrication
Cost Effective 3D Glass Microfabrication
In this extended abstract we present 3D Glass Solutions' efforts in using our proprietary APEX Glass ceramic to create various interposer technologies.
Production Floor

Authored By:
Jeb H. Flemming, Kevin Dunn, James Gouker, Carrie Schmidt, Roger Cook

3D Glass Solutions, Life BioScience
4343 Pan American Frwy NE
Albuquerque, NM 87107
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Interposer technologies are gathering more importance in IC packaging as the industry continues miniaturization trends in microfabrication nodes and IC packaging to meet design and utility needs in consumer electronics. Furthermore, IC packaging is widely seen as a method to prolong Moore's law. Historically, silicon has been the material of interest or interposer materials given its prevalence in IC production, but it presents many technical and costs hurdles.

In contrast, glass interposer technology presents a low cost alternative, yet attempts at producing advanced through glass vias (TGVs) arrays using traditional methods, such as laser ablation, have inherent process flaws, such as reduced interposer mechanical strength and debris sputtering among others.

In this extended abstract we present 3D Glass Solutions' efforts in using our proprietary APEX Glass ceramic to create various interposer technologies. This extended abstract will present on the production of large arrays of 10 micron diameter TGVs, with 20 micron center-to-center pitch, in 100 micron thick APEX Glass ceramic and the comparisons of wet etching of APEX Glass vs. laser ablation.
APEX Glass is an ideal substrate for 2.5D and 3D IC packaging applications. Wafer processing is accomplished through standard batch IC processes enabling a low cost alternative to silicon interposers. Furthermore, wet etching of the 3D structures, such as TGVs, produces a micro fracture-free product, leading to a more reliable product. 3D Glass Solutions has demonstrated the optimized production of 8 million 10 micron.
Initially Published in the IPC Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name






Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.

Related Programs
bullet Status and Outlooks of Flip Chip Technology
bullet Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates
bullet Three Dimensional Integration Focusing on Device Embedded Substrate
bullet Leadless Flip Chip PLGA for Networking Applications
bullet New Approaches to Develop a Scalable 3D IC Assembly Method
bullet Flip Chip LED Solder Assembly
bullet 3D IC Integration Technology Development in China
bullet Fine Pitch CU Pillar with Bond on Lead Assembly Challenges for High Performance Flip Chip Package
bullet Failure Modes in Wire Bonded and Flip Chip Packages
bullet Evaluation of Molded Flip-chip BGA Packages
More Related Programs