Electronics Assembly Knowledge, Vision & Wisdom
Low Cost Alternative to SAC Alloys
Low Cost Alternative to SAC Alloys
Paper discusses some new SAC alloy options, comparing performance to current low-cost options, and considers approaches to enhance the performance.
Materials Tech

Authored By:
Brook Sandy and Ronald Lasky, Ph.D., P.E.
Indium Corporation, Clinton, NY, USA
,{url:'http://www.circuitinsight.com/videos/low_cost_sac_alloy.mp4'},{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Transcript
Developing low-cost alternatives to near-eutectic SAC alloys for lead-free assembly is crucial to continue producing affordable electronics products.

Metals prices have been on the rise, and other factors, such as concerns about "conflict tin", indicate that this trend could likely continue.

Solder alloys with lower silver content have been considered, with trade-offs in performance, but are there alternatives?

This paper discusses some new alloy options, comparing performance to current low-cost options, and considers approaches to enhance the performance of low-cost solder alloys.
Summary
Developing low-cost alternatives to near-eutectic SAC alloys for Pb-free assembly is crucial to continue producing affordable electronics products. Metals prices have been on the rise, and other factors, such as concerns about "conflict tin", indicate that this trend could likely continue. Solder alloys with lower silver content have been considered, with trade-offs in performance, but are there alternatives? This paper discusses some new alloy options, comparing performance to current low-cost options, and considers approaches to enhance the performance of low-cost solder alloys.
Conclusions
In the foreseeable future it will become necessary for the near-eutectic alloys to be replaced by lower cost alloys with comparable properties. As many different alloys emerge with favorable properties, there is once again a struggle to find the best option. In order to insure equivalent comparisons, more work will need to be done to test alloys side by side in the same processes. We expect to report the results of this work in the future
Initially Published in the SMTA Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet How Many Fiducials Pre Solder Paste Stencil?
bullet Nanocopper Based Paste for Solid Copper Via Fill
bullet Fracture of Lead-Free Joints
bullet Microstructure and Reliability of Low Ag, Bi-Containing Solder Alloys
bullet Characterization of Solder Pastes Based on Two Alternative Alloys
bullet Mechanical Behavior of Bi-Containing Pb-Frees
bullet Lead-Free Alloys with Ultra-High Thermo-Mechanical Reliability
bullet Solder Paste Prep Before Use
bullet Low Temperature Solder Alloys for Portable Electronics
bullet Investigation into Lead-Free Low Silver Solder Wire for Electronics
More Related Programs