Electronics Assembly Knowledge, Vision & Wisdom
Problems to Look for with Crimp Terminations
Problems to Look for with Crimp Terminations
Bob Willis troubleshoots the challenges of using crimp terminations using the National Physical Laboratory's Process Defect Database.
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Authored By:
Bob Willis - http://www.bobwillis.co.uk
Bob Willis operates a training and consultancy business based in England.
,{url:'http://www.circuitinsight.com/videos/problems_crimp_terminations.mp4'},{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
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