Electronics Assembly Knowledge, Vision & Wisdom
Problems to Look for with Crimp Terminations
Problems to Look for with Crimp Terminations
Bob Willis troubleshoots the challenges of using crimp terminations using the National Physical Laboratory's Process Defect Database.
Production Floor

Authored By:
Bob Willis - http://www.bobwillis.co.uk
Bob Willis operates a training and consultancy business based in England.
,{url:'http://www.circuitinsight.com/videos/problems_crimp_terminations.mp4'},{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet Processing Circuit Boards with BGAs On Both Sides
bullet Wearable Electronics & Big Data = High Volume, High Mix SMT
bullet Evaluation of New SMT Stencil Materials
bullet One Big Cause of Assembly Problems
bullet Hand Printing using Nanocoated and other High End Stencil Materials
bullet Investigation Into the Durability of Stencil Coating Technologies
bullet Improve SMT Yields Using Root Cause Analysis in Stencil Design
bullet Unlocking The Mystery of Aperture Architecture for Fine Line Printing
bullet How To Determine Stencil Thickness
bullet Solder Paste Printing First Pass
More Related Programs