Electronics Assembly Knowledge, Vision & Wisdom
Causes and Solutions for Solder Beading
Causes and Solutions for Solder Beading
Industry expert Bob Willis explains how to address solder beading, a defect usually found on chip components. Hint: it's your stencils.
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Authored By:
Bob Willis - http://www.bobwillis.co.uk
Bob Willis operates a training and consultancy business based in England.
,{url:'http://www.circuitinsight.com/videos/causes_solder_beading.mp4'},{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Reader Comment

The tricky part would be to determine the amount of reduction needed underneath the chip, a great guidance to do that would be by drawing chip layout using the mechanical drawing in the datasheet and compare it to the SMT pads in copper layer, this way will make it easy to tell.

Labib B. Saleh, FCT Assembly, USA
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