Electronics Assembly Knowledge, Vision & Wisdom
Evaluation of Laminates for Pb-free HASL Process
Evaluation of Laminates for Pb-free HASL Process
Paper covers an evaluation of four FR4 laminates to determine their survivability for the lead-free hot air solder leveling process.
Materials Tech

Authored By:
Khaw Mei Ming, Andrey Lee
Agilent Technologies
Bayan Lepas, Malaysia
,{url:'http://www.circuitinsight.com/videos/evaluation_of_laminates.mp4'},{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Transcript
An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the lead-free hot air solder level process followed by a worst case lead-free manufacturing environment of 6 X reflow at 260 degrees C and 1 X wave at 270 degrees C.  

The work also includes a laminate compatibility study in a lead-free hot air solder leveling profile.
Summary
An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturing environment of 6 X reflow @ 260°C and 1 X wave @ 270°C. The work also includes a laminate compatibility study in a Pb-free hot air solder leveling (HASL) profile.
Conclusions
An important consideration for Pb-free materials, before any of the long-term reliability considerations are addressed, is the survivability of the laminates without degradation after the Pb-free assembly process. This survivability is further stressed if Pb-free HASL is used, which adds another thermal cycle to the board during the fabrication process. The HASL profile shows that any laminate that is currently coated with tin lead HASL should be able to withstand the Pb-free HASL processing temperatures under the same dip time conditions.

The voiding of Pb-free HASL boards was the same as in the immersion silver boards after extreme assembly conditions. As a chosen Pb-free compatible material approaches the 6 reflow and 1 wave thermal cycle limit, it is evident that we are very close to discovering more potential problems, with the early onset of voids. This project concluded that material survivability performance of a Pb-free product depends on the type of material that is used and layer count of the board.
Initially Published in the IPC Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet RF Capacitor Material for Use in Printed Circuit Board
bullet BGA Components and Coplanarity
bullet The Effects of PCB Fabrication on High-Frequency Electrical Performance
bullet Electronics Manufacturing by Inkjet Printing
bullet HASL vs. Immersion Gold
bullet Opening Eyes on Fiber Weave and CAF
bullet Study of Various PCBA Surface Finishes
bullet Advances in Conductive Inks Across Multiple Applications
bullet Long Term Thermal Reliability of Printed Circuit Board Materials
bullet Flexible Circuit Materials for High Temperature Applications
More Related Programs
About | Advertising | Contact | Directory | Directory Search | Directory Submit | Privacy | Programs | Program Search | Sponsorship | Subscribe | Terms

Circuit Insight
6 Liberty Square #2040, Boston MA 02109 USA

Jeff Ferry, Publisher | Ken Cavallaro, Editor/Business Manager

Copyright © Circuitnet LLC. All rights reserved.
A Circuitnet Media Publication