Electronics Assembly Knowledge, Vision & Wisdom
LGA/QFN Packages Floating During Reflow
LGA/QFN Packages Floating During Reflow
Bob Willis explains why LGA/QFN packages may float during reflow and how this may be associated with excess voids and open solder joints.
Analysis Lab

Authored By:
Bob Willis - http://www.bobwillis.co.uk
Bob Willis operates a training and consultancy business based in England.
,{url:'http://www.circuitinsight.com/videos/lga_qfn_package_floating.mp4'},{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
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