Electronics Assembly Knowledge, Vision & Wisdom
Rework of Large Surface Mount Connectors
Rework of Large Surface Mount Connectors
Paper discusses how to assemble and rework large SMT connectors and how to assure compliance without sacrificing solder joint reliability and performance.
Production Floor

Authored By:
Phil Isaacs and Sven Peng
IBM Corporation
Rochester, MN, USA, and Shenzen, China

Seow Wah Sng, Wai Mun Lee, and Alex Chen
Song Shan Lake, China, and Toronto, Canada
,{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
The advancement in performance of motherboard-daughter-card interconnects has been significantly increasing for several years. Due to the constraint of board surface real estate, the increase is seen in the higher I/O counts and the decrease in the signal integrity acceptance window. Through this evolution there has been a migration to ever more complex surface mount connectors. The complexity factor creates new challenges in assembly and rework of these connectors. The difficulty manifests itself through a number of factors; the increase in connector body size, the increase in mass, a significant increase in the number of contacts, or leads, the increase in lead density, the number of rows of leads which are now hidden by the connector housing from inspection or from touch-up all make the assembly and rework of the connector much more challenging. The use of advanced vapor phase reflow equipment is a key element to the success of this process. This paper discusses how to assemble this type of connector, how to rework the connectors and how to assure compliance to all connector requirements without sacrificing solder joint reliability and performance.
Initially Published in the SMTA Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name






Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.

Related Programs
bullet Best Method for Repairing Underfill Arrays?
bullet 6 Common Mistakes of BGA Rework
bullet Automatic Insertion Causing Plated Hole Damage
bullet How To Rework SMT Connector with Center Ground Strip
bullet WLCSP and BGA Reworkable Underfill Evaluation and Reliability
bullet Customer Approval for Repairs
bullet BGA Reballing and Influence on Ball Shear Strength
bullet Issues With BGA Rework Residue
bullet Estimating Failure Rate During Rework
bullet Should We Modify Rework Procedures for Assemblies Fabricated Using OSP?
More Related Programs