Electronics Assembly Knowledge, Vision & Wisdom
Past, Present, Future of Solderless Assembly
Past, Present, Future of Solderless Assembly
Paper examines some of the solderless assembly methods over the years and some new solutions we might see in the future.
Production Floor

Authored By:
Joseph Fjelstad
Verdant Electronics, Sunnyvale, CA, USA
,{url:'http://www.circuitinsight.com/videos/past_present_solderless.mp4'},{url:'http://www.circuitinsight.com/videos/programs_final.mp4'}], clip:{autoBuffering:true, autoPlay:true, scaling:'scale' } }).ipad();
Transcript
The forced transition to lead-free soldering foisted on the global electronics industry by a well meaning but misguided European parliament has actually resulted, according to the US EPA study, in a net worsening of the environment.

One prospective response to the ongoing challenge facing the electronics industry is to eliminate solder from the electronic interconnection process.

The concept is one that has deep roots in the electronics industry and it is now of growing interest to electronic product developers, especially among those in the military, aerospace and automotive markets but also in the portable electronics market.

This paper examines some of the many different methods that have been proposed or used over the years by the electronics industry and takes a look forward at some solutions that might lie in the future.
Summary
The forced transition to lead-free soldering foisted on the global electronics industry by a well meaning but misguided European parliament has actually resulted, according to the US EPA study, in a net worsening of the environment. One prospective response to the ongoing challenge facing the electronics industry is to eliminate solder from the electronic interconnection process. The concept is one that has deep roots in the electronics industry and it is now of growing interest to electronic product developers, especially among those in the military, aerospace and automotive markets but also in the portable electronics market. This paper will examine some of the many different methods that have been proposed or used over the years by the electronics industry and take a look forward at some solutions that
might lie in the future.
Conclusions
In summary, solderless assembly technologies have long been a part of the electronic interconnection process tool set. With the deleterious effects of high temperature solders now looming large on the manufacturing community and the increase in early failure of electronic assemblies, it is believed that solderless alloy free electronics (SAFE) will become a new standard for assembly as time progresses.

Given some of the recent reliability results reported by OKI for embedded device technology, it is assumed that solder alloy free electronic processes, such as that represented by the Occam process, will give the OEM a new choice for producing products that should prove a highly reliable and cost effective approach to electronic assembly and the printed circuit manufacturer the possibility to reinvent and redefine the circuit manufacturing process in a way that adds significant value while reducing overall costs and increasing reliability while reducing overall costs and increasing reliability while easily cleaning the hurdles put in place by the EU's RoHS legislation.
Initially Published in the SMTA Proceedings
Submit A Comment

Comments are reviewed prior to posting. Please avoid discussion of pricing or recommendations for specific products. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Company


E-mail


Country


Comments


Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.



Related Programs
bullet Processing Circuit Boards with BGAs On Both Sides
bullet Wearable Electronics & Big Data = High Volume, High Mix SMT
bullet Evaluation of New SMT Stencil Materials
bullet One Big Cause of Assembly Problems
bullet Hand Printing using Nanocoated and other High End Stencil Materials
bullet Investigation Into the Durability of Stencil Coating Technologies
bullet Improve SMT Yields Using Root Cause Analysis in Stencil Design
bullet Unlocking The Mystery of Aperture Architecture for Fine Line Printing
bullet How To Determine Stencil Thickness
bullet Solder Paste Printing First Pass
More Related Programs